| HS Code | 624980 |
| Appearance | Part A and Part B colored viscous liquids |
| Mixing Ratio By Weight | 1:1 |
| Density | 1.10–1.20 g/cm³ |
| Viscosity At 25 C | 2,000–4,000 mPa·s |
| Pot Life At 25 C | ≥60 min |
| Curing Condition | 25°C × 24 h or 80°C × 30 min |
| Hardness Shore A | 25–35 |
| Tensile Strength | ≥1.0 MPa |
| Elongation At Break | ≥120% |
| Dielectric Strength | ≥20 kV/mm |
| Volume Resistivity | ≥1×10^14 Ω·cm |
| Thermal Conductivity | ≥0.20 W/(m·K) |
| Operating Temperature Range | -50°C to +200°C |
| Flame Retardancy | UL 94 V-0 |
As an accredited Two-component Silicone Potting Adhesive RH-PG0184 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Two-component Silicone Potting Adhesive RH-PG0184 is packaged in 10 kg two-part kits, with each component in a separate container. |
| Container Loading (20′ FCL) | 20′ FCL loading of RH-PG0184 two-component silicone potting adhesive: securely palletized, lashed, labeled, and stowed for ocean shipment. |
| Shipping | Ship RH-PG0184 as two separate components in original sealed containers at ambient temperature, protected from moisture, heat, freezing, and direct sunlight. Follow SDS and local transport regulations; verify dangerous-goods classification and required documentation before shipment. |
| Storage | Store in a cool, dry, well-ventilated area away from direct sunlight, heat sources, sparks, and moisture. Keep containers tightly closed and clearly labeled; store Part A and Part B separately to prevent accidental mixing. Protect from humidity and contamination, avoid freezing and extreme temperatures, follow the SDS and local regulations, and use oldest stock first. |
| Shelf Life | Shelf life is 12 months from manufacture when stored cool, dry, and well-ventilated in sealed original unopened packaging. |
In 800 V traction battery pack electronics, the two-component silicone potting adhesive RH-PG0184 is introduced into low-voltage battery management system boards that must remain electrically isolated from the pack’s aluminum enclosure even when condensation forms during altitude changes from 0 m to 4,000 m at a rate of 10 m/s. The metering line uses a gear-pump dispenser with an 18-element static mixer and a shot-size check at 0.5 g accuracy; Part A and Part B are mixed at 1:1 by weight with a tolerance of ±2%. The ratio is not varied as a process adjustment because the addition-cure network density is controlled by hydride-vinyl stoichiometry; an offset of 3% from the 1:1 ratio lowers Shore A hardness from 50 ±5 to below 40 and leaves free methyl hydrogen siloxane fractions that can be detected by headspace gas chromatography at 80°C for 30 minutes. Boards are preheated to 55°C for 20 minutes in a 45% RH chamber to remove condensation from exposed copper pads; then the material is vacuum-degassed at 5–10 mbar for 90–120 seconds after mixing and cured at 80°C for 30 minutes. Terminal products include 48-cell and 96-cell cell-monitor units, contactor driver boards, and high-voltage sense harness junction blocks.
Compliance verification for this segment references IEC 62631-3-1 volume resistivity above 1 × 10^14 Ω·cm at 500 V DC, UL 746E for potted printed-wiring assembly insulation acceptance, ISO 20653 for IP67 ingress after thermal shock, and EU 2015/863 RoHS restrictions. Further, the potted assembly is cycled per IEC 60068-2-14 Test Na from −40°C to 105°C for 1,000 cycles; optical inspection rejects interface delamination exceeding 0.2 mm. Experience from production lots shows that adhesion to FR4 surfaces declines when ambient RH exceeds 60%; boards stored in uncontrolled conditions require pre-drying at 105°C for 2 hours. Platinum catalyst inhibition occurs when the same tray carrier previously contacted sulfur-vulcanized rubber gaskets or amine-cured epoxy segregation. Published data for the exact 1,000-cycle thermal endurance of this specific RH-PG0184 configuration is limited; incoming quality control therefore uses differential scanning calorimetry to confirm exothermic cure onset between 75°C and 90°C before release to production.
| Standard designation | Test condition | Acceptance criterion |
|---|---|---|
| IEC 62631-3-1 | 500 V DC, 23 ±2°C | Volume resistivity ≥ 1 × 10^14 Ω·cm |
| UL 746E | Potted PCB insulation after 7 days at 105°C | No dielectric breakdown below 1,500 V AC |
| ISO 20653:2013 IP67 | Immersion 1 m, 30 min | No ingress into potting cavity |
| IEC 60068-2-14 Test Na | −40°C to 105°C, 1,000 cycles | Interface delamination ≤ 0.2 mm |
When the silicone-potted DC-DC converter stage is assembled after selective soldering, the highest thermomechanical strain is located at the edge of the MnZn ferrite transformer core, where the linear thermal expansion coefficient of the ferrite is approximately 1.2 × 10⁻⁵ K⁻¹ and the cured silicone network is above 2.0 × 10⁻⁴ K⁻¹; the resulting shear strain must be accommodated without detaching from the core leg or lifting the copper windings. The A/B mix is metered at 1:1 by volume, but gravimetric dispensers compensate for density values of 1.12 g/cm³ for Part A and 1.06 g/cm³ for Part B to prevent feed ratio drift during dispense runs longer than 45 minutes. After static mixing, the filled dispersion is degassed under 10 mbar absolute pressure until the surface bubble collapse rate falls below 1 bubble per 30 seconds; this step is the only definitive control for partial discharge inception in the 150–300 kHz switching-frequency band. Terminal assemblies include 6.6 kW and 11 kW on-board chargers, silicon carbide DC-DC converters, and auxiliary power modules. Compliance under automotive electronics requires AEC-Q200 stress references for passive component integrity, UL 1446 insulation system coordination, and IPC-CC-830 B qualification for materials where the potted unit is repaired after rework. In production, filler settling in the Part B container can occur after 72 hours of stationary storage; if the container is not remixed, the thermal conductivity falls from 0.25 W/m·K to 0.20 W/m·K in the bottom third of the drum. The material is not suitable for direct contact with exposed copper busbars above 150°C because the silicone decomposition onset measured by thermogravimetric analysis is near 230°C only in nitrogen; air aging at 180°C for 1,000 hours shows progressive hardness increase above 65 Shore A and loss of elongation below 50%.
In process automation enclosures certified under ATEX and IECEx, the potted terminal compartment of a multivariable pressure transmitter must retain its intrinsic safety barrier even after methane gas exposure and rapid decompression from 150 bar to atmospheric pressure. The A/B mix is dispensed at 1:1 by weight through a 24-element static mixer; however, before filling, the terminal compartment is dried at 60°C for 30 minutes to reduce moisture trapped in the cable conduit. The production process begins with the transmitter body heated to 40°C, followed by injection of the degassed silicone at 5 mbar to remove gas pockets from wiring ducts; after gelation at 25°C for 12 hours, a post-cure at 100°C for 4 hours completes the hydrosilylation. Terminal products include HART 4–20 mA pressure transmitters, level radar electronics, Coriolis flow transmitter converters, and valve position feedback modules. Standards referenced for the application include IEC 60079-11 for intrinsic safety parameters, EN 60079-0 for general requirements, EN 60529 for ingress protection, and Directive 2014/34/EU for equipment category marking. OEM qualification records show that bubble retention at the cable gland interface increases thermal resistance by 0.05 K/W per 1% void content. The cured network swells slightly in direct contact with aromatic hydrocarbons such as toluene; exposure to C6–C8 aromatic streams above 60°C should be avoided unless a fluorosilicone topcoat is specified for the wetted surface.
IGBT modules for 25 kV AC railway traction inverters are potted in their gate-drive cavities to suppress flashover caused by condensation along the high-voltage gate-drive traces. The material is processed at 1:1 by weight with a maximum air-free density of 1.02 g/cm³ after 10 mbar degassing. Because the gate-drive PCB is populated with high-lead SMD terminations, the potted unit is cured at room temperature for 24 hours rather than thermally accelerated to avoid warpage from the 140 × 90 mm FR4 panel. The downstream production process includes a first shot of 22 g per cavity, a 5-minute vacuum hold at 50 mbar, and a second shot to complete fill before the gel point; this two-stage filling prevents resin starvation at the stand-off wires. Terminal products include traction inverter gate-drive boards, line-commutated rectifier snubber circuits, and brake chopper control modules. Compliance for rail applications includes EN 45545-2 R22/R23 fire hazard criteria, EN 61373 Class B shock/vibration, and IEC 61287-1 for traction converter insulation. Production batch-to-batch viscosity of Part A can vary from 1,200 mPa·s to 1,800 mPa·s at 25°C; when a high-viscosity lot is processed through a 24-element static mixer, the mixing pressure rises by 0.25 MPa and entrapped air increases if the feed pressure is below 0.6 MPa. Published data for this specific configuration is limited; in-house qualification typically uses 1,000 thermal cycles from −50°C to 125°C and partial discharge measurement below 10 pC at 3.6 kV. The material is not suitable for direct-bonded aluminum heat sinks with continuous copper temperatures above 165°C.
Across photovoltaic microinverters installed behind glass-glass modules, the silicone potting must survive 85°C enclosure interior temperatures, 85% RH, and partial shadowing-induced load transients without cracking around the DC-link capacitor leads. For this application, the two components are degassed individually at 10 mbar before metering at 1:1 by volume; after dispensing, a second in-mold vacuum at 5 mbar for 180 seconds is used to eliminate voids in the potted power-stage cavity. The cured layer is 4–6 mm thick over the PCB and 2 mm over the aluminum capacitor can; thickness control is maintained by a laser height sensor with a tolerance of ±0.3 mm to avoid excessive thermal resistance at the enclosure lid. Terminal products include microinverters in the 250–350 W class, DC power optimizers, and rapid shutdown modules. Standards referenced include IEC 62109-1 for grid-connected inverter safety, IEC 61215-1:2021 where the microinverter is integrated with the module, and UL 61730 for North American listing. The manufacturing line uses an optical bubble inspection at 2.5 × magnification; pores larger than 0.15 mm are rejected because they reduce partial discharge inception voltage below 1,800 V AC in accelerated test. Silicone reversion in the presence of condensed water and high ultraviolet exposure has not been observed after 2,000 h of damp-heat testing per IEC 60068-2-78 at 85°C/85% RH; nevertheless, terminals adjacent to power resistors above 110°C must be kept clear of the potting due to thermal aging and subsequent hardness drift.
When potted LED driver cavities are sealed with a clear silicone dome over the secondary optics, the degree of unreacted methyl silicone in the network determines the rate of light-transmission loss at the dome interface. The two-component mix is dosed at 1:1 by weight and applied at 25°C; the cavity is filled to 85% of total volume to allow thermal expansion without exceeding 0.1 MPa interfacial stress on the polycarbonate lens. The downstream process includes a 10-minute vacuum break at 50 mbar, followed by ambient cure for 24 hours before the luminaire assembly is torqued to 0.5 N·m. Terminal products include 60 W architectural floodlight drivers, street light LED gear trays, and low-voltage path light modules. Compliance is assessed under UL 8750 for LED lighting equipment, EN 61347-1 for lamp controlgear safety, and EN 62493 for electromagnetic field exposure. The cured silicone’s Shore A hardness of 55 ±5 per ASTM D2240 is specified to balance vibration isolation with the gasket seal. A limitation arises when the same potted driver is exposed to solvent-based cleaning agents after cure; surface discoloration occurs after 24-hour immersion in methyl ethyl ketone at 25°C, so isopropyl alcohol wipe is the only approved cleaning fluid for production rework. Published data for long-term ultraviolet exposure in high-lumen street lighting beyond 5,000 hours is limited; current qualification uses IEC 60068-2-5 Test C solar radiation exposure and records dome transmission loss below 3%.
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RH-PG0184 is a two-component addition-cure silicone potting adhesive supplied as a flowable elastomer-forming liquid. The formulation is based on a vinyl-functional polydimethylsiloxane and a hydride-functional crosslinker activated by a platinum catalyst; curing proceeds without the release of acetic acid, oxime, or methanol. This release profile distinguishes the product from condensation-cure RTV silicone adhesives when the encapsulant contacts tinned copper, brass, or polycarbonate enclosures. The two components are mixed in a ratio of 1:1 by weight using static mixing or meter-mix equipment. Mixed viscosity at 23 °C under ISO 3219 is typically 2500–5000 mPa·s, and work life at 23 °C/50 % RH is 60–120 min. Cure is performed at 80 °C for 30 min on accelerated lines or at 23 °C for 24 h at ambient temperature. The addition reaction reaches functional strength in 8–12 h at 23 °C and full properties after 7 days. The cured compound exhibits Shore A hardness of 40–60 when tested to ISO 868. The material is supplied in side-by-side cartridges or bulk containers intended for automated potting equipment.
Acceptance data are generated on cured slabs after 7 days at 23 °C/50 % RH unless the certificate of analysis states a different post-cure condition. The electrical acceptance limits are aligned with IEC 61086-1 and IEC 61086-2 for insulating compounds, while flammability is assessed under UL 94. The low modulus and high elongation reduce stress transfer to surface-mount ceramics and glass-passivated semiconductor junctions; however, the actual stress reduction on a specific component should be verified by thermal cycling according to IEC 60068-2-14.
| Property | Test method | Value or range |
|---|---|---|
| Mixed viscosity at 23 °C | ISO 3219 | 2500–5000 mPa·s |
| Work life at 23 °C/50 % RH | rotational viscometer, time to double initial viscosity | 60–120 min |
| Accelerated cure | forced-air oven | 80 °C/30 min |
| Ambient cure | controlled laboratory atmosphere | 23 °C/24 h |
| Hardness | ISO 868 | Shore A 40–60 |
| Tensile strength | ISO 37 Type 4 | 3.0–5.0 MPa |
| Elongation at break | ISO 37 Type 4 | 80–150 % |
| Secant modulus at 100 % elongation | ISO 37 | 0.8–2.5 MPa |
| Dielectric strength at 2 mm | IEC 60243-1 | 18–22 kV/mm |
| Volume resistivity | IEC 62631-3-1 | ≥1.0×1014 Ω·cm |
| Dielectric constant at 1 MHz | IEC 62631-2-1 | 2.8–3.2 |
| Dissipation factor at 1 MHz | IEC 62631-2-1 | ≤0.002 |
| Thermal conductivity | ISO 22007-2 | 0.9–1.6 W/(m·K) |
| Flammability | UL 94 | V-0 at 3 mm |
| Service temperature range | IEC 60216 thermal endurance programme | −50 °C to 180 °C |
Dielectric strength is thickness-dependent: values measured at 1 mm can exceed the 2 mm figure shown above, while values at 5 mm are lower because of statistical weak points and residual internal stress. Comparisons between suppliers must therefore specify the same specimen thickness and electrode configuration.
On automated potting lines, RH-PG0184 is degassed at 1–5 kPa residual pressure before transfer to progressive cavity pumps or piston metering cylinders. For a 20 kg bulk pail, degassing cycles of 30–60 min are common until visible froth collapses; the required time depends on fill level and container diameter. The static mixer should contain 16–32 elements. With fewer than 16 elements, striping and ratio drift become measurable at shot sizes below 2 cm³. A ratio error exceeding ±5 % can leave unreacted hydride or reduce tensile strength; shot weight is maintained within ±3 % by gravimetric calibration. Barrel and nozzle temperature is controlled at 25–30 °C to prevent short shots without reducing work life below 45 min. If the housing contains PBT connectors, adhesion to the polymer is material-dependent; published data for this specific configuration is limited, and a supplier-qualified primer or plasma pre-treatment may be required. Batch-to-batch filler settling is controlled by rolling or recirculation before metering because stagnation can increase local thermal conductivity and mask viscosity drift.
The addition-cure reaction is inhibited by organotin compounds, sulfur-cured rubbers, butyl sealants, amine-containing flux residues, and plasticized PVC. Contact with these materials can leave an uncured gel layer within 1–3 mm of the contaminant. Tin-catalysed condensation RTV silicone does not share this platinum-poisoning pathway, but it relies on moisture ingress and is unsuitable for sections above 10 mm because cure becomes diffusion-limited. RH-PG0184 therefore requires substrate cleanliness verification; cavities containing sulfidic gaskets or tin-bearing flux residues are pretested by curing a small witness sample before full potting. A tacky surface or tensile strength below 2 MPa on the witness sample indicates inhibition. Deep-section cure is feasible because the hydrosilylation reaction does not require atmospheric moisture, but the low exotherm makes thermal confirmation necessary in sections above 20 mm. Published data for this specific configuration is limited when cavity depth exceeds 50 mm and filler loading is simultaneously above 0.9 W/(m·K). Condensation on cold substrates is avoided by maintaining substrate temperature at least 3 K above the dew point before dispensing.
If the potting cavity exceeds 15 mm in depth and component fill fraction rises above 60 %, the process window narrows because air release competes with gelation at elevated cure temperature. Vacuum potting is applied at 10–50 mbar residual pressure after dispense, with hold time extended until visible bubble release stops. Backfilling is performed with dry air or nitrogen to prevent moisture condensation on the resin surface. The low mixed viscosity permits penetration into fine-wire windings with wire diameters down to 0.05 mm when vacuum is applied, but settling of thermally conductive filler under long residence times must be monitored by sampling from the bottom of the holding tank. The bulk thermal conductivity of 0.9–1.6 W/(m·K) reduces hotspot rise compared with unfilled silicone, but the upper value is not sufficient to replace direct copper heat spreaders in high-power-density magnetics. Production observations for similar addition-cure silicone systems indicate that bubble entrapment in three-phase inductor windings is reduced by lowering the dispense flow rate during the first 30 % of cavity volume and increasing it after the winding is covered. Published data for this specific configuration is limited when the hotspot is located under a core clamp or when potted mass exceeds 2 kg.
Compared with anhydride-cured epoxy potting, RH-PG0184 transmits lower mechanical stress to ceramic capacitors and glass-passivated semiconductor junctions. Epoxy potting systems typically exhibit tensile strength above 40 MPa and modulus above 1 GPa under ISO 527-2, while RH-PG0184 remains below 5 MPa tensile strength and has a secant modulus at 100 % elongation below 2.5 MPa under ISO 37. The low modulus is relevant to assemblies with surface-mount ceramic capacitors in aluminium housings; direct capacitance-shift data should be generated on the specific capacitor type because stress depends on substrate geometry and cure shrinkage. Compared with aromatic polyurethane potting, RH-PG0184 maintains flexibility and dielectric properties at higher continuous service temperature; many aromatic urethanes hydrolyse or embrittle above 120 °C, while the silicone is specified up to 180 °C when thermal endurance is validated under IEC 60216. Against one-component alkoxy RTV silicone adhesives, RH-PG0184 cures uniformly in thick sections and does not rely on atmospheric moisture, but it requires precise metering and has a limited work life after mixing.
| Property and method | RH-PG0184 | Epoxy potting | Polyurethane potting |
|---|---|---|---|
| Hardness (ISO 868) | 40–60 Shore A | 85–90 Shore D | 70 Shore A–65 Shore D |
| Tensile strength (ISO 37/ISO 527-2) | 3–5 MPa | 40–60 MPa | 5–15 MPa |
| Elongation at break (ISO 37) | 80–150 % | 1–3 % | 50–200 % |
| Thermal conductivity (ISO 22007-2) | 0.9–1.6 W/(m·K) | 0.4–0.8 W/(m·K) unfilled | 0.4–0.8 W/(m·K) |
| Continuous upper service temperature | 180 °C (IEC 60216) | 130 °C | 120 °C |
| Cure exotherm in large mass | low | high | moderate |
| Cure shrinkage | ≤0.5 % | 1–3 % | 0.5–2 % |
Regulatory documents for RH-PG0184 normally include RoHS conformity under Directive 2011/65/EU and REACH registration or pre-registration under Regulation EC 1907/2006. Halogen content can be assessed by EN 14582 when a low-halogen grade is requested. The material is not automatically approved for food-contact or medical use; if such assessment is required, the formulation should be reviewed against FDA 21 CFR 177.2600 or USP Class VI requirements. Shelf life from manufacture is typically 12 months in unopened containers stored at 5–25 °C. Storage below 0 °C is not recommended because filler separation can occur. Before dispensing, containers are equilibrated to 23 °C and homogenized gently.
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