| HS Code | 835670 |
| Productname | Thermal Grease RH-TSG-5582 |
| Model | RH-TSG-5582 |
| Producttype | Thermal Grease |
| Color | Grey |
As an accredited Thermal Grease RH-TSG-5582 Grey Viscosity mPa.s 700000 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packed in 1 kg cartridges, RH-TSG-5582 Thermal Grease is a grey paste with 700,000 mPa·s viscosity for industrial use. |
| Container Loading (20′ FCL) | Thermal Grease RH-TSG-5582, grey, 700,000 mPa·s viscosity, securely loaded in a 20-foot FCL container with proper cargo securing. |
| Shipping | Thermal Grease RH-TSG-5582, grey, 700,000 mPa·s, is a non-hazardous thermal interface material. Ship in sealed, labeled syringes, cartridges, cans, or pails protected from contamination and extreme temperatures. No UN number or dangerous-goods declaration is normally required; confirm against the current SDS and local regulations. |
| Storage | Store Thermal Grease RH-TSG-5582 in its original, tightly closed container in a cool, dry, well-ventilated area away from direct sunlight, moisture, heat, and ignition sources. Protect from freezing and extreme temperatures; keep containers clean and clearly labeled. Avoid contact with oxidizers, acids, and alkalis. Rotate stock and use within the manufacturer’s shelf life. |
| Shelf Life | Typically 12 months from manufacture when stored unopened in a cool, dry, well-ventilated place, away from sunlight and moisture. |
On production lines assembling IGBT modules for three-phase industrial drives, Thermal Grease RH-TSG-5582 grey at 700000 mPa·s is deposited through laser-cut stainless steel stencils onto aluminium heat sink pads before the module baseplate is fastened. The paste is a one-component, pre-mixed compound; no catalyst addition ratio or reactive let-down is performed by the end user. A stencil thickness of 100–150 µm is generally specified for this viscosity class, with aperture area ratio held between 0.66 and 1.10 relative to the heat sink pad land. Below 0.66, the paste may not release cleanly from the aperture walls because the high low-shear viscosity resists separation from the stencil side wall. Above 1.10, paste slump after squeegee lift can exceed the pad boundary and contaminate adjacent screw bosses. Squeegee speed is typically set to 20–50 mm/s with a stainless steel blade edge at 45°; snap-off is kept at 0.3–0.6 mm. These settings are not self-certifying; an incoming paste batch is checked for slump using a modified ASTM D2202 test or equivalent because filler orientation after transport can shift the yield stress. The filled silicone matrix is non-curing, so clamp torque and paste thickness determine final interface pressure rather than a cure schedule. For M5 fasteners in this segment, torque values are often limited to 0.4–0.6 N·m to avoid bowing the module baseplate, but the exact torque depends on substrate flatness and insert material; published data for this specific configuration is limited. After assembly, the paste must survive thermal cycling from -40 °C to 125 °C under IEC 60068-2-14 test Na without lateral pump-out from the interface.
The table below summarises dispense windows reported in equipment technical bulletins for greases in the 600000–800000 mPa·s class; the values are reference points and require on-line verification for this product.
| Deposition method | Operating window for 600000–800000 mPa·s class | Failure mode outside window | Typical terminal assembly |
|---|---|---|---|
| Metal stencil print | stencil thickness 100–150 µm; squeegee 20–50 mm/s; snap-off 0.3–0.6 mm | aperture starvation, non-uniform bond line | IGBT power module |
| Auger volumetric dispense | feed pressure 0.35–0.7 MPa; rotor speed 50–150 min⁻¹; nozzle ID 0.6–1.2 mm | stringing, air entrapment, shot volume drift | server CPU/GPU |
| Pneumatic cartridge dispense | pressure 0.15–0.4 MPa; shot 0.5–1.5 s; nozzle ID 0.8–1.5 mm | tailing, inconsistent dot mass | LED array |
Material compliance for the power module application is specified against RoHS Directive 2011/65/EU Annex II and REACH Regulation (EC) No 1907/2006; halogen-free requirements are evaluated per IEC 61249-2-21. UL 94 V-0 applies to the assembly housing or insulating sheet, not to the paste itself. Terminal products include motor drive inverters, solar string inverters, and uninterruptible power supply modules. The paste must not be used as a corrosion-inhibiting coating on exposed copper in sulphur-bearing atmospheres; silicone oil migration can alter the interface boundary over extended service. Rework involves solvent wipe rather than heat softening because the material remains a viscous liquid film.
Automated volumetric auger dispensing in server CPU assembly imposes different constraints from stencil printing. The lidded processor package is already mounted to the mainboard before the paste is applied to the integrated heat spreader, so the dispense pattern must provide full coverage after cold plate compression without spilling over the seal land. For a grease with low-shear viscosity of 700000 mPa·s, a single central dot is generally insufficient because the paste does not flow to the corners under typical liquid cooling cold plate clamping loads of 0.10–0.25 MPa; instead, an X-pattern, five-dot pattern, or serpentine path is used. The dispense system is typically a closed-loop progressive cavity pump with a metering section selected for filled polydimethylsiloxane greases in this viscosity class and a needle ID of 0.6–1.0 mm. Feed pressure is maintained at 0.35–0.7 MPa, and nozzle retraction is set with a suck-back of 0.05–0.15 s to prevent stringing. Shot mass tolerance is usually held to ±5% in server lines because underdispense increases local thermal impedance while overdispense contaminates socket retention springs. Thermal performance is validated by ASTM D5470-17 at a controlled bond line thickness; the standard imposes a specific heat flux and measures thermal impedance across the interface. The paste itself does not cure, so the bulk thermal impedance after assembly depends on clamp flatness and surface roughness, not post-assembly curing. Published data for this specific product under ASTM D5470-17 at 50 µm and 80 °C hot-side temperature are limited. The terminal products are 1U and 2U rack servers, GPU accelerator assemblies, and liquid-cooled high-performance computing modules. Operation outside the dispense window leads to shot mass drift and air entrapment; air pockets as small as 0.5 mm in diameter can dominate local thermal impedance under high heat flux. Avoid combining the paste with solvent-based cleaning residues on the cold plate because solvent extraction can form a low-viscosity boundary film.
For metal-core printed circuit boards used in high-bay LED luminaires, the 700000 mPa·s paste is stencil-printed onto the aluminium core before the LED board is bolted to the extruded heat sink. The process is selected for low slump rather than for ease of flow. Stencil apertures are aligned to the thermal pad array under each 5050 or 3030 LED package, and the aperture area ratio is held near 0.7–1.0. Because the paste has a high tack after printing, board inversion during handling does not displace the deposit; this matters when the PCB is transferred between printing and fastening stations. The coating thickness after clamping typically falls in the 50–80 µm range when a 0.1 mm stencil is used, but the final thickness must be confirmed with a contact micrometer because the paste resists compression at low torque. Compliance for luminaire assemblies includes UL 8750 for LED equipment and IEC 62717 for LED module performance; the thermal interface itself must not reduce dielectric insulation below the limits specified in IEC 61347-1 if it is used near live parts. In practice, the paste is not applied between live electrical leads, so the more critical requirement is that it must not flow onto solder pads during thermal aging. Solderability after stencil misregistration is a known failure mode; if grease crosses the pad edge, it can interfere with reflow wetting even if reflow is performed before board mounting. Terminal products include streetlight modules, high-bay industrial luminaires, and horticultural fixtures with aluminium heat sinks. Relative humidity above 60% RH during board storage requires pre-drying at 60–80 °C for 2 h before printing to prevent microvoids from trapped moisture at the interface.
The interface between a die-cast aluminium ECU housing and its lid is filled by screen printing or robot dispensing onto the housing flange. In this segment, the 700000 mPa·s paste is used as a non-curing gap filler that transfers heat from the PCB-mounted power devices to the housing while tolerating vibration. The dispense path follows the perimeter of the component region and uses a continuous bead, not individual dots, so that mechanical clamping spreads the paste into a void-free film. A typical bead width after clamping is 3–6 mm with a final thickness of 100–150 µm; thicker films are limited by the paste's thermal impedance, while thinner films may not accommodate housing flatness tolerance. The housing is fastened in a cross-pattern sequence with torque-controlled pneumatic drivers; automotive lines often set torque to 0.5–0.8 N·m for M3 inserts, but this must be derived from the fastener specification and housing material. Vibration stability is evaluated according to ISO 16750-4, and thermal shock is evaluated according to IEC 60068-2-14. The paste must not pump out after 1000 cycles from -40 °C to 105 °C; pump-out is measured by mass loss and visual inspection beyond the flange. Terminal products are engine control units, transmission control units, body domain controllers, and battery management system modules. Rework compatibility is a process constraint: the paste is silicone-based and does not crosslink, so rework requires solvent cleaning rather than heat softening. Avoid direct immersion in automatic transmission fluid or engine oil; silicone paste can be extracted by hydrocarbon fluids and lose film continuity. For applications under the vehicle floor, an additional IP sealing gasket is required because the paste is not a replacement for environmental sealing.
In a GaN charger assembly line, the heat spreader is pressed onto the populated PCB after grease placement on the transformer-side copper pad. The 700000 mPa·s paste is applied as a single dome or cross pattern through a needle ID of 0.4–0.8 mm; after pressing, the deposit spreads under 0.05–0.1 MPa clamp pressure. No curing stage exists, so the final thermal interface remains a viscous liquid film. This condition shifts the reliability burden to the mechanical fastening design: if the heat spreader is retained only by a hot-melt stake or snap feature, the paste may relax over time due to thermal expansion mismatch. The paste is specified for this application because it does not slump during assembly inversion and does not drip onto the primary-side creepage path. Electrical safety compliance is evaluated under IEC 62368-1, and the material must meet RoHS Directive 2011/65/EU Annex II in the finished assembly. Terminal products are USB-C PD chargers, GaN travel adapters, and desktop fast-charging stations. A process limitation is that the paste must not contact the optical light pipe or logo lens; low molecular weight siloxane migration can form a film that reduces light transmittance. On automated lines, the dispense needle is purged after every 2 h to prevent material skinning at the nozzle, and open idle time before spreading is kept below 4 h at 23±2 °C.
Outdoor telecom RRU assembly uses the paste on vertical surfaces where a 700000 mPa·s paste is less likely to sag before final housing closure. The PA transistor pallet is mounted against a die-cast aluminium heat sink with the paste between the pallet backplate and the housing floor. Because the pallet surface is often nickel-plated and the housing may be chromate-conversion coated, the paste film must be applied with a stencil thickness of 80–120 µm to match the flatness tolerance. The assembly is closed with a sealing gasket; the paste is not an environmental barrier. Vibration testing follows GR-487-CORE and IEC 60068-2-6; thermal shock follows IEC 60068-2-14. Terminal products are remote radio heads, active antenna units, and tower-mounted power amplifiers. A frequent field failure occurs when paste is applied outside the pad and contacts sealing surfaces, causing gasket adhesion loss due to silicone contamination. Therefore, stencil aperture size is reduced by 0.5 mm per side from the pallet edge to limit bleed-out. In high-altitude sites with large daily temperature swings, the interface must survive -40 °C to 85 °C non-operating. The material should not be combined with alkyd or oil-based coatings adjacent to the interface because solvent extraction can cause shrinkage cracking of the paste film.
Welding power supplies and induction heating inverters require periodic maintenance of semiconductor-to-heatsink interfaces, and the 700000 mPa·s grey paste is applied during module replacement rather than at initial board assembly. The service technician spreads a thin layer with a polypropylene spatula or applies a metered bead from a cartridge; no mixing ratio applies because the product is supplied as a one-component compound. The target thickness after clamping is 50–100 µm, but service environments rarely have a clean flatness reference, so torque-controlled clamping is used to approach a uniform film. Compliance for the equipment falls under IEC 60974-1 for arc welding power sources and UL 508A for industrial control panels in North America. Terminal products are inverter-based welders, plasma cutting power supplies, and induction heating generators. The service interval for paste replacement is not set by the paste itself but by the onset of thermal fault codes or after a power semiconductor replacement. Because the paste contains no solvent and is non-curing, it can remain serviceable for 5 years if the interface is not disturbed; however, published long-term ageing data for this specific formulation under continuous 100–120 °C hot-spot duty are limited. Do not use the paste as a corrosion-inhibiting coating on fusible links or on surfaces that carry current creepage, because fillers may align under electrical stress and violate clearance design values.
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Thermal Grease RH-TSG-5582 Grey is supplied as a grey, high-consistency thermal interface material with a reported apparent viscosity of 700000 mPa·s. The model designation RH-TSG-5582 places the product in the high-viscosity class of non-curing pastes used between heat-generating semiconductor packages and heat sinks, cold plates, or module housings. The reported viscosity is a single-point apparent value; because the material is non-Newtonian and thixotropic, the reading depends on spindle geometry, rotational speed, sample temperature, and shear history. Incoming quality control should record the rotational viscometry method, preferably ISO 3219 or an equivalent internal procedure, together with the spindle identity and test temperature.
The grey coloration is associated with the dispersed filler system. The material is intended to remain conformable after assembly and does not require the cure schedule of thermally conductive adhesives or the melt transition of phase-change films. Consequently, pot life is controlled by drying, filler settling, or contamination rather than by chemical crosslinking. Closed cartridges and pails should be stored in accordance with the supplier’s label; if the storage temperature is not stated, the paste should not be frozen or exposed to direct sun. Temperature changes during shipment can temporarily alter the apparent viscosity, so containers should be equilibrated to line conditions before viscosity verification.
The control specification for this product should include the batch identity and the nominal viscosity of 700000 mPa·s. No further specification is to be inferred from this description. Density, filler content, thermal conductivity, volatile content, and bleed cannot be derived from viscosity alone and must be obtained from the supplier’s certificate of analysis or technical data sheet. Published data for this specific RH-TSG-5582 formulation is limited beyond the model, color, and viscosity stated here.
Regulatory status must be verified from the supplier’s materials declaration. If the assembly must comply with EU RoHS Directive 2011/65/EU or REACH Regulation (EC) No 1907/2006, the end user should request the full substance-level disclosure rather than relying on the product class. The absence of a curing agent does not by itself establish low outgassing or suitability for sealed optical modules. Where outgassing is relevant, ASTM E595 or an application-specific outgassing limit should be included in the qualification plan.
Dispensing a 700000 mPa·s thermal grease in production is constrained by yield stress and thixotropic recovery rather than by gravity flow. A positive-displacement auger valve or piston pump with mechanical snuff-back is generally preferred for this viscosity class. Time-pressure systems can be used with large-diameter needles, but shot-weight drift may occur as entrapped air compresses and as the cartridge empties. Because published data for this specific RH-TSG-5582 configuration is limited, the dispense profile must be developed on the target equipment using shot-weight studies at the start, middle, and end of each cartridge.
The high zero-shear viscosity contributes to slump resistance but does not by itself prevent tailing at the needle tip. Needle internal diameter, retract distance, and valve closing speed must be balanced. If the paste fails to separate cleanly, a pre-shear conditioning step or a different nozzle geometry may be evaluated, but the effect should be confirmed by consecutive shot-weight data rather than by visual inspection alone. For high-volume SMT lines, a gravimetric check at 3 to 5 intervals per cartridge provides a useful control limit, but the exact frequency should be derived from the line’s process capability.
Stencil printing of RH-TSG-5582 Grey requires a metal stencil and large aperture geometry. Fine apertures can retain paste because the material does not flow readily into newly exposed apertures after the squeegee blade passes. Aperture area ratio, squeegee speed, pressure, and snap-off distance should be included in a print DOE. The resulting printed thickness is a function of stencil thickness and release behavior, not solely of paste viscosity.
Rheological characterization should distinguish between yield stress and viscosity. A controlled-stress rheometer with parallel-plate geometry and a roughened surface can be used to measure the shear stress at which the paste begins to flow. This yield stress is more relevant to slump and printability than the single-point viscosity. For RH-TSG-5582 Grey, the yield stress value must be supplied by the formulator or measured internally; it is not implied by the 700000 mPa·s apparent viscosity. A paste with high viscosity may have a low yield stress if it contains plate-like fillers that align under shear, while a high yield stress may coexist with moderate viscosity after shearing. These two parameters should not be conflated in dispense or print specifications.
| Standard or test method | Parameter addressed | Application in qualification |
|---|---|---|
| ISO 3219 | Rotational viscometry for non-Newtonian materials | Fixed-spindle apparent viscosity after defined pre-shear |
| ASTM D5470 | Thermal transmission through interface materials | Thermal impedance and apparent thermal conductivity at stated bond line thickness and pressure |
| ASTM E595 | Outgassing under vacuum | Optional evaluation for sealed optical or space assemblies |
| RoHS 2011/65/EU | Restricted hazardous substances | Supplier declaration for EU market access |
At the mounting stage, the thermal resistance of RH-TSG-5582 Grey is governed primarily by bond line thickness, surface wetting, and clamping pressure. Thermal interface greases fill microscopic air gaps between the component lid and heat sink base; the bulk viscosity influences how easily the paste forms a thin, continuous layer under a given load. A 700000 mPa·s paste may require higher compression force than a lower-viscosity grease to reach the same bond line thickness. Therefore, clamp force or screw torque should be taken from the module or heat sink supplier rather than from generic thermal grease guidelines. Thermal impedance should be measured in accordance with ASTM D5470 or an equivalent steady-state method, with the bond line thickness and applied pressure recorded.
Surface preparation should remove oxide films, dust, and organic residues. On copper bases, a solvent wipe with a substrate-qualified solvent can improve wetting, but solvent choice must be checked against adjacent polymer components. The grease should not be diluted with silicone oil or organic solvents to lower viscosity; dilution changes the filler network and may increase bleed-out and thermal resistance drift. Solder flux residues should be removed before application because polar activators may interact with the filler surface treatment and promote phase separation.
To avoid entrapped air pockets, a single large central dot may be replaced by an X pattern or multiple lines. The optimal dispense pattern depends on die or lid size, flatness, and clamp sequencing. Cross-section or acoustic microscopy after assembly can reveal voids that are not visible at the interface edge. If void area exceeds the application limit, the dispense pattern, bead height, or compression sequence should be revised; published data for RH-TSG-5582 Grey in this specific configuration is limited.
On surfaces with roughness above 0.4 µm Ra, the bond line requirement should be interpreted with reference to the surface roughness and waviness. If the heat sink base has a waviness of 2 µm over the component area, a nominal bond line of 10 µm may not be achievable without local contact pressure. Surface flatness should be recorded before grease application; no amount of paste compensation can correct for a bowed lid or a heat sink that does not meet the mechanical drawing.
Substitution of RH-TSG-5582 Grey into an assembly originally qualified with a phase-change film changes the compression requirement. Phase-change films soften at a fixed temperature and flow during initial power-on, reducing the mechanical work required to reach a thin bond line. The 700000 mPa·s grease has no melt transition and must be compressed during assembly. This gives an immediate thermal interface without a thermal activation step, but gross flatness defects must be corrected mechanically rather than by increasing paste thickness. The material is not a structural adhesive; therefore, mechanical fasteners or springs remain necessary.
When a lower-viscosity grease is replaced, the primary process changes are in dispense equipment and rework. A paste in the 200000 mPa·s range can often be dispensed with time-pressure valves and narrow needles; a 700000 mPa·s material generally requires positive-displacement metering or higher pressure. In stencil printing, the higher viscosity improves slump resistance but reduces aperture release. Rework cleaning may require longer solvent contact or mechanical wiping, and residual filler may remain in surface roughness. Cleaning effectiveness should be verified by surface energy testing or optical inspection rather than by color alone. Thermal performance equivalence must be established on the actual hardware because thermal conductivity cannot be inferred from viscosity, color, or filler loading without a thermal test.
Before replacing a phase-change film, a qualification run should compare thermal impedance at time-zero and after thermal cycling. The time-zero advantage of the grease may be offset by higher pump-out if the clamp load is insufficient. A comparative thermal impedance test using ASTM D5470 at a fixed bond line thickness and pressure provides a direct laboratory comparison. Hardware-level tests using power diodes or thermal test chips can also be used, but the measured junction temperature must be corrected for package resistance. The user should not rely on a single viscosity value to predict the outcome.
In clamped modules with close lid-to-heat-sink tolerance, the higher initial viscosity can hold the heat sink slightly above the final position until the paste is compressed. Operators should follow a controlled torque sequence; an uncontrolled diagonal tightening pattern can trap thickness variation and create high local thermal resistance at the corners. The final bond line should be checked after the first production builds using either cross-section or thickness probes if accessible.
Thermal cycling of a clamped package imposes cyclic shear at the thermal interface because the die, substrate, and heat sink expand at different rates. A high-viscosity grease with 700000 mPa·s bulk viscosity generally offers greater resistance to pump-out and edge migration than a low-viscosity grease, but the failure mode can shift to internal cohesive fracture or void formation if the imposed strain exceeds the material’s yield limit. The relevant flow properties under use conditions are the storage modulus, loss modulus, and yield stress measured by small-amplitude oscillatory shear. A strain sweep at the expected interfacial displacement can identify the critical strain at which the filler network breaks. Published data for RH-TSG-5582 Grey in a specific die-stack configuration is limited; the supplier should be asked for the linear viscoelastic range and the complex modulus at the power-cycling frequency and temperature of interest.
Under power cycling with a temperature swing of 40 °C or more, interface shear accumulates. If the paste has a high filler loading, its modulus may increase with ageing as the polymer matrix loses low-molecular-weight fractions. The aged modulus can be higher than the initial modulus, which can worsen edge cracking. Ageing should therefore be performed at the upper expected temperature for at least 1000 h and followed by rheological testing. Published data for this specific product under all end-use conditions is limited, so this test plan is recommended.
Failure inspection after thermal cycling should include acoustic microscopy for planar void mapping and cross-sectioning for filler orientation. Low-viscosity greases often exhibit migration toward the perimeter, while high-viscosity greases may show center depletion if the heat sink bows away from the die corners. Screw clamp patterns alter the strain distribution; tightening one screw fully before the opposite side can create a wedge-shaped bond line and locally high shear. For a paste of this consistency, the manufacturing assembly sequence should be standardized and periodically verified with bond line thickness measurements.
Long-term exposure to elevated temperatures can increase the viscosity of some silicone-based greases through volatile loss or low-level crosslinking. If the supplier has not published an upper continuous-use temperature, the user should not extrapolate from generic polydimethylsiloxane fluid data. Thermogravimetric analysis, post-ageing viscosity, and outgassing data provide more direct evidence of thermal stability. Filler settling in bulk containers can also occur; drums or pails should be re-homogenized according to the supplier’s instructions before use.
In sealed optical assemblies, camera modules, laser diode packages, or telecom transceivers, volatile siloxane fractions can deposit on optical surfaces even when the grease is non-curing. A high-viscosity paste may still release low-molecular-weight siloxane species under heat and vacuum. For these applications, the user should perform ASTM E595 or supplier-specified outgassing testing before release. The paste should not be applied to surfaces that will subsequently be wire-bonded, solder-wetted, or adhesive-bonded, because silicone contamination can compromise wetting and interfacial adhesion. In such sequences, the grease should be dispensed after all soldering, wire bonding, and cleaning operations are complete.
In assemblies subjected to vibration or shock without uniform clamping, the paste may migrate and allow intermittent contact. The adequacy of the clamping design should be confirmed by mechanical testing of the final assembly under the same vibration or shock profile used for product qualification. The viscosity class alone does not guarantee mechanical retention in every orientation, particularly for heavy heat sinks mounted normal to a circuit board. Thermal impedance should be re-measured after vibration and thermal cycling to detect contact loss before production release.
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