| HS Code | 938980 |
| Product Name | Thermal Grease RH-TSG-5582 |
| Model Number | RH-TSG-5582 |
| Product Type | Thermal Grease |
| Color | White |
| Viscosity | 120000 mPa.s |
| Thermal Conductivity | 1.5 W/m·K |
| Operating Temperature Range | -40°C to 200°C |
| Density | 2.2 g/cm³ |
| Dielectric Strength | ≥5 kV/mm |
| Volume Resistivity | ≥1×10^14 Ω·cm |
| Oil Bleed | <0.5% |
| Evaporation Loss | <1% |
| Rohs Compliance | Yes |
| Shelf Life | 12 months |
As an accredited Thermal Grease RH-TSG-5582 White Viscosity mPa.s 120000 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Packaging: Thermal Grease RH-TSG-5582 White, viscosity 120,000 mPa·s, supplied in 1 kg sealed jars, one jar per carton. |
| Container Loading (20′ FCL) | Container Loading (20′ FCL): Load white Thermal Grease RH-TSG-5582, 120,000 mPa·s, in sealed packages; palletize, secure, and keep dry. |
| Shipping | Shipping Description: Thermal Grease RH-TSG-5582, white paste, viscosity 120,000 mPa·s. Pack in clean, sealed, labeled containers. Keep dry at ambient temperature, away from direct sunlight and freezing. Handle as non-hazardous general cargo unless the SDS or transport regulations state otherwise; no UN number required. |
| Storage | Store Thermal Grease RH-TSG-5582 in a cool, dry, well-ventilated area away from direct sunlight, heat sources, and ignition hazards. Keep containers tightly closed in original labeled packaging to prevent contamination and moisture ingress. Protect from freezing and extremes of temperature. Maintain good housekeeping and follow local regulations and SDS requirements. |
| Shelf Life | Shelf life is about 12 months from production when kept sealed in a dry, cool, ventilated place, away from direct sunlight. |
RH-TSG-5582 is specified as a white, single-component thermal grease supplied at a nominal dynamic viscosity of 120000 mPa·s. In high-volume electronics assembly, this viscosity class imposes specific handling constraints on screen printers, progressive-cavity dispensing pumps, and stencil apertures. Because the available product input does not include thermal conductivity, filler particle size distribution, or bleed behavior, any line qualification must include ASTM D5470 thermal impedance coupons prepared from production substrates with the same Ra surface roughness. The following downstream scenarios address real assembly conditions where paste viscosity, not only thermal conductivity, controls deposit height retention, bondline thickness, and rework yield.
On a water-cooled traction inverter line, RH-TSG-5582 is applied to a nickel-plated copper IGBT baseplate before the module is drawn against a milled aluminum heatsink channel. A laser-cut stainless stencil of 0.100 mm to 0.150 mm thickness is used with an angled squeegee at 25–50 mm/s and an attack angle of 45°–60°; the paste deposit is printed in a rectangular pattern that covers the baseplate land without spreading into bolt holes. Single-component chemistry requires no mixing ratio adjustment. The module is placed by a gantry pick-and-place head within 15 min of printing to prevent the 120000 mPa·s paste from developing a surface skin. M6 fasteners are torqued in a diagonal sequence from 0.8 N·m to 1.2 N·m, producing an average bondline between 60 µm and 100 µm. Operators inspect the assembly under C-SAM; void area fraction above 5 % is rejected because entrapped air paths increase thermal resistance under peak IGBT junction temperature. The finished traction inverter module is qualified to the electrical and environmental requirements of IEC 61287-1 for power converters used in rolling stock. The table below contains the pre-production verification matrix.
| Parameter | Control band | Reference method |
|---|---|---|
| Viscosity at 25 °C | 120000 mPa·s nominal | Rotational viscometer, T-bar spindle 96 at 0.5 rpm |
| Bondline thickness | 60–100 µm | Non-contact laser profilometry after fastening |
| Thermal impedance | ≤0.05 K·cm²/W at 70 psi | ASTM D5470-17 |
| Flammability | V-0 at 0.8 mm thickness | UL 94 V-0 |
| Global compliance | Confirmation required | RoHS 2011/65/EU and REACH SVHC declaration |
Deposit height drift after an idle dwell on server IHS-to-cold-plate lines is controlled by reshearing RH-TSG-5582 before the first production board. The nominal viscosity of 120000 mPa·s provides high-green-strength deposit walls, but thixotropic recovery after shearing in a cartridge or stencil can raise the apparent viscosity of the printed pad. A production dispenser with a progressive cavity pump and a 20 G needle typically starts at volumetric flow of 0.06–0.15 mL/s, while a stencil line uses 0.120 mm apertures and 0.5 mm/s snap-off speed. If the line stops for more than 30 min, the first and second deposits after restart may exhibit a thickness increase of up to 0.03 mm when measured by a non-contact laser sensor. That shift compresses into a thicker bondline, and ASTM D5470 measurements at 50 psi show that thermal impedance rises when bondline exceeds 90 µm. To avoid this drift, the robot performs two waste depositions before each restart, and the printer uses a controlled stroke count to reshear the paste. The finished server board assembly is validated under JEDEC JESD22-A104 thermal cycling from −5 °C to 85 °C for 500 cycles, with thermal resistance monitored after every 100 cycles. UL 94 V-0 certification and RoHS 2011/65/EU Annex II data remain the material-level compliance gate for this application.
In COB LED engine assembly, RH-TSG-5582 is dispensed as a single-component white paste onto an extruded aluminum heat sink before the chip-on-board package is pressed to a target bondline. The 120000 mPa·s nominal viscosity permits a continuous bead to be laid down without slumping over the heat sink’s side walls; a 0.25–0.40 g dose per package is practical for a 13 mm × 13 mm COB. A XYZ dispensing robot with a 20 G conical needle and a variable-speed auger valve deposits the paste at a line speed of 20–40 mm/s. The pick-and-place head then moves the COB into the paste with z-axis placement force of 20–50 N; two M2 screws are tightened to 0.3–0.5 N·m in alternating steps. The paste must cover the full ceramic substrate back; a transparent squeeze-out ring of 0.5–1.0 mm width around the package edge is considered visual evidence of full wet-out. Finished luminaires are evaluated for thermal derating under IEC 62031:2018 and UL 8750, while the grease itself must comply with RoHS 2011/65/EU and the SVHC reporting obligations of REACH. Production lines operating above 60 % relative humidity should keep the paste cartridge sealed and purge the needle before placement because condensation on the aluminum substrate can lower interfacial wetting and produce void clusters.
Because a die-cast aluminum enclosure serves as both structural housing and heat spreader, sealed automotive ECU lines apply RH-TSG-5582 to the PCB thermal land before the printed circuit board is fastened to the enclosure. A single-component paste with nominal viscosity 120000 mPa·s is used in this application because it resists dripping after screen printing and can be applied after reflow without additional cure. A pneumatic time-pressure valve with a 21 G needle dispenses 0.15–0.35 mL per ECU depending on the land area; no mixing ratio is required. The PCB is placed over the paste and drawn down with self-tapping screws torqued in two passes to 0.5–0.8 N·m. The resulting bondline typically falls between 70 µm and 130 µm across a 40 mm unsupported board span. Qualification tests follow ISO 16750-4 temperature cycling from −40 °C to 85 °C and ISO 16750-3 random vibration profiles; after 100 cycles, thermal impedance measured by ASTM D5470 on witness coupons must not exceed 0.08 K·cm²/W. This limit is derived from the maximum allowed junction temperature of the voltage regulator FETs under full-load operation, not from the grease’s own spec sheet. Operators use the white color of RH-TSG-5582 as an automated optical inspection contrast marker; absence of paste on the land triggers a gate reject. Finished ECUs are sealed to IP67 under IEC 60529; the thermal interface is considered acceptable only when no paste migration is observed in the connector area after vibration.
In industrial DC-DC converter modules, the cast aluminum enclosure is part of the thermal path, so RH-TSG-5582 is applied between a TO-247 power transistor and the enclosure’s machined thermal pad. The paste is applied with a stencil aperture of 0.100 mm thickness; the 120000 mPa·s viscosity allows clean aperture release without bleeding into adjacent creepage slots. A single-component formulation eliminates metering errors and pot-life concerns. After screen printing, the discrete transistors are placed with a pick-and-place head and secured with spring clips that apply 15–25 N of normal force, producing a bondline of 50–80 µm when measured on witness assemblies. Thermal designers should verify that the mounting clip does not tilt the device, because a tilted TO-247 can create a wedge-shaped bondline from 50 µm at one edge to 140 µm at the opposite edge; under ASTM D5470 testing, wedge-shaped gaps increase the apparent thermal impedance above the flat-plate value. The module must pass IEC 61800-5-1 for adjustable-speed electrical power drive systems and carry a UL 94 V-0 material certificate for polymeric compounds. In 48 V bus converter designs, the grease is also expected to remain in place under full-load vibration; if the application includes continuous exposure to silicone oil mist from the adjacent mechanical system, compatibility testing under ISO 1817 immersion conditions is recommended. The terminal product is a potted DC-DC converter where the only replaceable thermal interface is the pre-cured grease layer, so rework requires solvent-free cleaning with a lint-free wipe and reapplication to the original bondline target.
Deposit edge sharpness in 5G remote radio unit assembly is controlled by the thixotropic recovery of RH-TSG-5582, especially when the power amplifier board is mated to an anodized aluminum heat sink through a printed paste layer. The material’s nominal viscosity of 120000 mPa·s is high enough to maintain aperture geometry after a zero-gap screen stroke, but its thixotropic recovery means that peel-off speed affects deposit edge sharpness. A metal squeegee with 0.150 mm stencil openings prints the paste over a 35 mm × 35 mm power amplifier land; peel-off speed is set at 2–5 mm/s. If peel-off is faster than 10 mm/s, the paste filament snaps at the aperture edge and leaves a non-uniform surface. The board is then inverted and torqued in a four-point sequence to 0.6 N·m ± 0.1 N·m. Because rework occurs before environmental sealing, the paste layer must be inspected with a confocal chromatic sensor; zones thinner than 60 µm after torquing are flagged for potential air void formation. No mixing ratio is required because the product is supplied as a one-part paste, but stored cartridges must be brought to 23 °C ± 2 °C for 8 h before use. The final radio unit is rated IP65 per IEC 60529, and the thermal interface is considered robust only if no paste bleed reaches the mating surface beyond 1.0 mm from the land. Published data for this specific product in RRU configurations is limited; qualification therefore relies on coupon testing per ASTM D5470 at 50 psi and 100 psi rather than on a vendor-reported single-point conductivity value.
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The designation Thermal Grease RH-TSG-5582 White Viscosity mPa.s 120000 identifies a white thermal interface material with a reported viscosity of 120000 mPa·s, equivalent to 120000 cP. The test temperature and shear rate associated with the reported viscosity are not included in the abbreviated product identifier. This value places the material in the high-viscosity, non-slumping class of thermal greases rather than in low-viscosity, free-flowing dispensable grades. The abbreviated designation contains model, color, and viscosity, but it does not supply thermal conductivity, thermal impedance, dielectric strength, density, filler chemistry, carrier fluid type, or application temperature limits. Those parameters require verification against the manufacturer’s full technical datasheet before design qualification. The following paragraphs define the operational significance of the stated viscosity in dispensing, interface formation, pump-out resistance, rework, and comparison with other thermal interface materials.
| Parameter | Reported value | Data status |
|---|---|---|
| Product designation | RH-TSG-5582 | Supplied |
| Color | White | Supplied |
| Viscosity | 120000 mPa·s (120000 cP) | Supplied; shear rate and test temperature not stated |
| Thermal conductivity | Not stated | Manufacturer datasheet required |
| Dielectric strength | Not stated | Manufacturer datasheet required |
| Density | Not stated | Manufacturer datasheet required |
The viscosity value must be interpreted as an apparent viscosity, not a Newtonian constant. Filled thermal greases exhibit shear-thinning and yield-like behavior; viscosity depends on shear rate, temperature, and time. Under ISO 3219, rotational viscosity is reported with spindle geometry, rotation speed, and temperature. Under ASTM D2196, Brookfield viscometer protocols require spindle and speed data. The abbreviated RH-TSG-5582 description does not provide those conditions. A paste at 120000 mPa·s may appear as a stiff, non-flowing body at rest and may be softened by shearing during dispensing. Process development therefore cannot rely on the nominal viscosity alone; a shear-rate sweep or dispense-response trial is required to set machine parameters.
The viscosity of a filled thermal grease typically decreases with increasing temperature. A 120000 mPa·s value reported at 25 °C may be significantly lower at 50 °C. This is relevant when the material is used in preheated assembly stations or when the heat sink is at elevated temperature during fan-cooled operation. The exact temperature coefficient of viscosity for RH-TSG-5582 is not supplied in the abbreviated designation. Process engineers should request a viscosity-temperature curve or run a controlled cartridge-temperature trial before committing the paste to a heated dispensing line.
Needle dispensing of a 120000 mPa·s paste is possible only with equipment sized for high back pressure. Pneumatic cartridge systems depend on air pressure, cartridge geometry, needle inner diameter, and paste rheology. A 25 gauge stainless steel needle may generate excessive back pressure or shear heating; 18 gauge to 20 gauge needles are more practical for high-viscosity greases, but the minimum needle size must be confirmed by line trial. Positive-displacement auger valves and piston pumps are preferred because they deliver volumetric shots independent of viscosity drift and are less sensitive to air pressure. Cavitation occurs when the auger cavity does not refill between shots. With a stiff white paste, a cartridge pre-warming zone at 30 °C to 35 °C can reduce viscosity and improve feed, but the manufacturer’s maximum storage and handling temperature must be observed. Heating above 40 °C may accelerate carrier separation or degrade the thickener network; without datasheet authorization, heated dispensing should not be used.
For design engineers, the selection criterion is not whether the material can be dispensed, but whether the required deposit shape can be repeated at cycle time. The high viscosity resists needle stringing and tail formation, but it also requires higher shutoff response in valve systems. In high-volume production, a progressive cavity pump or volumetric piston valve with a servo-driven shutoff is generally preferable to a time-pressure system. The specific model RH-TSG-5582 should be characterized by shot-weight capability studies across a range of back pressures and needle sizes before line release.
Stencil printing provides another route for this product. Laser-cut or electroformed stencils with aperture widths from 0.3 mm to 1.0 mm can deposit controlled volumes on flat heat spreader surfaces. The squeegee speed must be reduced relative to solder paste and the squeegee angle maintained near 45° to 60° to ensure aperture fill without smearing. Aperture retention after stencil lift is enhanced by the high apparent viscosity, but residue on the stencil underside can build up if the solvent cleaning interval is not matched to filler adhesion. The choice of cleaning solvent depends on the base fluid; alcohol-based solvents may be insufficient for non-silicone carriers, while strong aromatic or chlorinated solvents may damage the filler network. Stencil printer settings for RH-TSG-5582 should be developed using a solder paste inspection system to check deposit height and voiding.
The thermal performance of RH-TSG-5582 is not described by color or viscosity. The controlling test is ASTM D5470-17, in which a thin specimen is compressed between heated and cooled meter bars and the steady-state temperature difference is measured. The result is expressed as thermal impedance in K·mm²/W or equivalent units. For this product, no ASTM D5470-17 result is supplied in the abbreviated identifier. In application, the paste must achieve a thin, continuous bond line without air pockets. A viscosity of 120000 mPa·s increases resistance to squeeze-out during assembly. If the paste is applied too thick or the clamping pressure is insufficient, the bond line will remain thicker than necessary and the interface thermal resistance will increase. The package manufacturer’s specified clip force, spring load, or torque is the governing mechanical input; uncontrolled force beyond the package rating can damage silicon.
| Method | Property | Relevance to RH-TSG-5582 |
|---|---|---|
| ISO 3219 | Rotational viscosity | Apparent viscosity must be reported with shear rate, spindle, and temperature; abbreviated data lacks these conditions. |
| ASTM D5470-17 | Thermal impedance | Primary thermal performance metric; not supplied. |
| IEC 60243-1 | Dielectric strength | Required for high-voltage electrical isolation; not supplied. |
| ASTM D257 | Volume and surface resistivity | Required for electrical insulation claims; not supplied. |
| ISO 1183-1 | Density | Used for gravimetric shot weight calibration; not supplied. |
After assembly, the bond line thickness can be measured by cross-sectioning or by non-contact profilometry of mating surfaces before assembly. For a filled paste, voids at the interface are critical because entrapped air has a thermal conductivity of approximately 0.026 W/(m·K) at 25 °C. Even a small void fraction increases thermal impedance. The high viscosity of RH-TSG-5582 may reduce air entrapment during stencil printing, but voids can form if the paste does not wet the surface or if the component is placed too slowly. Controlled bead placement and a slow initial compression may allow air to escape before the final clamp force is applied.
Application environments for a high-viscosity white thermal grease include power module assembly, automotive electronic control unit lid-to-heat-sink interfaces, LED lighting modules, and industrial drives where vertical or inverted mounting is required. In a direct bond copper IGBT module, the paste must cover the substrate backside without bleeding towards the isolation boundary. RH-TSG-5582, at 120000 mPa·s, resists gravity-driven migration before mounting; however, coverage must be confirmed by x-ray or pressure mapping if the interface is inaccessible after clamping. In LED luminaires, the paste may be applied to the back of a metal-core printed circuit board before attachment to an aluminum extrusion. The material remains non-curing, so service rework can be accomplished by disassembly, cleaning with the approved solvent, and reapplication. This distinguishes the paste from thermally conductive adhesives, which cure and cannot be reworked without mechanical scraping or bond line fracture.
Thermal greases are non-curing liquids with low yield stress. Under power cycling, the coefficient of thermal expansion mismatch between a silicon die, direct bond copper, baseplate, and heat sink produces cyclic shear at the interface. The paste can migrate away from the heat source, increasing thermal impedance over time. This failure mode is termed pump-out. A paste with 120000 mPa·s apparent viscosity has greater resistance to pump-out than a flowable grade intended for low-pressure needle dispensing because each thermal cycle displaces less material. The benefit is conditional: overfilled bond lines, excessive paste area, and non-uniform clamp force can still produce migration in any grease. Validation requires thermal cycling under IEC 60068-2-14 or a power cycling profile that reproduces the application’s temperature swing, such as −40 °C to 125 °C for automotive modules. Vibration exposure can also cause flowable greases to migrate; the high viscosity of RH-TSG-5582 reduces this tendency, but the product cannot replace a cured adhesive when zero pump-out is required.
Storage and handling conditions for RH-TSG-5582 should follow the manufacturer’s datasheet. The abbreviated description does not specify filler type, carrier fluid, or shelf life. Rotational grease systems can separate during prolonged storage, releasing a clear liquid layer at the surface. Containers should be stored upright at temperatures between 5 °C and 30 °C unless the manufacturer specifies otherwise. Before use, the material should be inspected for separation; if surface oil is present, a low-shear planetary mix may restore uniformity, but high-shear mixing should be avoided because it can generate heat and damage the filler structure. If the paste is exposed to freezing during shipment, it must be allowed to equilibrate to room temperature before dispensing, and the manufacturer should be consulted to confirm that freeze–thaw cycles do not alter the viscosity.
Regulatory compliance for a thermal grease used in electronic assembly must be confirmed against the manufacturer’s declaration. The abbreviated designation does not state whether the product is silicone-free, halide-free, or compliant with the RoHS Directive 2011/65/EU. If the component is intended for high-voltage isolation or safety-critical use, dielectric strength, comparative tracking index, and flammability rating under UL 94 should be requested. Thermal greases may not be considered electrical insulators unless explicitly certified; white color alone does not verify dielectric properties.
When compared with cured thermal pads, RH-TSG-5582 offers lower interface resistance under thin bond lines but requires a more controlled dispensing process. Compared with low-viscosity thermal greases, the higher viscosity reduces slumping and pump-out, but may limit fine-needle dispensing and requires higher applied pressure to spread. Compared with RTV thermal adhesives, the paste remains reworkable and does not add structural bond strength. These differences should be evaluated through the full datasheet and application-specific testing rather than by viscosity and color alone.
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