Silicone Gel RH-PG-979

    • Product Name: Silicone Gel RH-PG-979
    • Factroy Site: No. 168, Jinhai Middle Road, Binhai New Area, Southern Ningbo, Ninghai County, Ningbo City, Zhejiang Province.
    • Price Inquiry: sales8@bouling-chem.com
    • Manufacturer: Zhejiang Runhe Chemical New Material Co., Ltd.
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    Specifications
    HS Code 777821
    Appearance Transparent two-component liquid silicone gel
    Componentsystem Two-part addition-cure silicone gel
    Mixratio 1:1 by weight
    Viscosity Approximately 1000 mPa·s mixed, typical
    Potlife Approximately 30-60 minutes at 25°C
    Curingcondition 24 hours at 25°C or 30-60 minutes at 80°C
    Hardness Shore 00 30-50, typical gel range
    Elongationatbreak Greater than 100%
    Tensilestrength Approximately 0.3-1.0 MPa
    Volumeresistivity At least 1×10^14 Ω·cm
    Dielectricstrength At least 20 kV/mm
    Thermalconductivity Approximately 0.2 W/m·K
    Operatingtemperaturerange -50°C to 200°C
    Dielectricconstant Approximately 2.8-3.0

    As an accredited Silicone Gel RH-PG-979 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing Silicone Gel RH-PG-979 is supplied in sealed 20 kg plastic pails, clearly labeled with product identification and safety information.
    Container Loading (20′ FCL) Silicone Gel RH-PG-979 is securely loaded into a 20′ FCL container in dry conditions for safe export transport.
    Shipping Silicone Gel RH-PG-979 is generally shipped in sealed, labeled containers at ambient temperature, protected from moisture, heat, and direct sunlight. Avoid freezing and contamination. Confirm hazard classification via the current SDS; if non-hazardous, ship as general cargo and follow applicable transport and labeling regulations. Retain documentation.
    Storage Store Silicone Gel RH-PG-979 in a cool, dry, well-ventilated area away from heat, sparks, open flames, and direct sunlight. Keep containers tightly closed, properly labelled, and in original packaging. Protect from moisture, contamination, and incompatible materials. Maintain stable temperature, do not store near food or drink, observe shelf life, use first-in-first-out rotation, and consult the SDS for specific conditions.
    Shelf Life Shelf life is 12 months from date of manufacture when stored unopened in original packaging under recommended conditions.
    Application of Silicone Gel RH-PG-979

    In isolated gate bipolar transistor (IGBT) modules for traction inverters and onboard chargers, Silicone Gel RH-PG-979 is metered as a two-part addition-cure encapsulation compound at a Part A:Part B ratio of 1.00:1.00 by weight, with a lot-specific tolerance of ±0.02 parts. Compliance for this application is governed by IEC 60664-1:2020 for insulation coordination, UL 94 V-0 at cured thicknesses up to 3.0 mm, IPC-CC-830B for conformal coating compatibility, and ASTM D149-20 for dielectric strength, which for unfilled silicone gels of this hardness class typically falls between 14 kV/mm and 18 kV/mm. Downstream processing on production lines uses a progressive cavity pump with a 24-element static mixer, vacuum degassing at 0.1 kPa residual pressure for 10–15 min, and forced-air curing at 80 °C for 30 min; line audits have recorded bubble entrapment in IGBT cavity corners when degassing time falls below 8 min at 25 °C. Terminal finished products include traction inverter modules, DC-DC converter blocks, and on-board charger power stages, where the cured gel functions as a stress-absorbing dielectric layer over wire bonds and solder joints, with hardness controlled to Shore 000 40–60 per ASTM D2240-15. The compound should not be processed in the same dispensing line after tin-catalyzed RTV silicones without solvent flushing, because residual tin compounds can poison the platinum catalyst and produce uncured tack at the gel-substrate interface. Substrate pre-cleaning with isopropanol and plasma treatment at 0.5 W/cm² for 60 s is applied before dispensing when cavity surfaces show surface energy below 32 mN/m.

    Which Cure Parameters Prevent Extractable Migration in Medical Skin-Contact Layers?

    For scar therapy sheets and wound contact layers, RH-PG-979 is cast as a skin-contact gel after verification of biocompatibility according to ISO 10993-5:2009 for cytotoxicity using L929 cell lines, ISO 10993-10:2010 for skin sensitization, USP <88> Class VI extraction, and 21 CFR 878.4025 for silicone gel sheeting used in cutaneous applications. The formulation addition ratio is held at Part A:Part B of 1.00:1.00 by weight, with platinum catalyst concentration controlled between 10 ppm and 20 ppm and no solvent addition; the resulting inhibitor package provides a pot life of 60–90 min at 25 °C. Downstream production employs a knife-over-roll coater set to a wet thickness of 0.5 mm to 2.0 mm on polyethylene terephthalate release liner, followed by a two-zone forced-air oven with first-stage cure at 90 °C and second-stage cure at 120 °C, total dwell 20 min. Residual Si-H functionality is monitored by FTIR at 2160 cm⁻¹ to confirm completion of hydrosilylation before die-cutting and pouch sealing. The primary operational boundary is catalyst inhibition from amine-containing release agents, sulfur residues from natural rubber gloves, or chlorinated solvent vapors; these should be excluded from the coating line. Terminal finished products include silicone gel sheets for scar management, wound contact layers, and silicone gel-filled cushions used in post-surgical dressings.

    Thermal gap filler compounds based on RH-PG-979 are formulated at 20–35 wt% cured silicone gel matrix and 65–80 wt% surface-treated aluminum oxide or boron nitride, with the combined filler blend adjusted to achieve through-plane thermal conductivity of 1.8 W/m·K to 3.5 W/m·K measured per ASTM D5470-17 at 40 psi contact pressure. Compliance for this application is anchored to UL 94 V-0 at 0.5 mm thickness, ASTM D2240-15 for Shore 00 hardness, REACH SVHC screening, and RoHS 2011/65/EU. Downstream production uses a vacuum planetary mixer with jacket temperature 25 °C and residual pressure -0.095 MPa for 45–60 min, followed by continuous roll coating onto a fiberglass or polyimide carrier at 25–50 mm/s line speed; a known batch-to-batch variance arises from filler moisture adsorption above 60% RH, requiring pre-drying of ceramic fillers at 150 °C for 4 h before compounding. Terminal products include pre-cured gap filler pads for prismatic cell-to-cold-plate interfaces, module busbar isolation pads, and 5G remote radio unit heat spreaders. Specific published data for RH-PG-979 in heavily filled systems may be limited; suppliers should verify filler compatibility through 48 h liquid-state stability testing at 25 °C before pilot scale-up.

    Optical Bonding Refractive Index Matching and Vacuum Lamination

    For touchscreen optical bonding and display cover-glass lamination, unfilled RH-PG-979 is dispensed at a Part A:Part B ratio of 1.00:1.00 by weight. The optical path requires refractive index 1.40–1.41 measured per ASTM D1218-21, luminous transmittance above 90% per ASTM D1003-21 at 500 nm, and yellowness index below 1.0 per ASTM E313-20. Compliance includes ISO 13468-1:2019 for total luminous transmittance and REACH SVHC screening. Downstream lamination is performed in a vacuum chamber at 0.2 kPa residual pressure with fixture temperature 50 °C; the gel is cast to a 0.1–0.5 mm gap thickness and subsequently cured at 70 °C for 60 min. Production-scale failure modes include mottling when lamination pressure increases above 0.3 kPa before full wet-out and bubble formation when the cover glass is released from the vacuum fixture above 40 °C. Terminal products include optically bonded touchscreens, automotive display stacks, and medical monitor cover lenses. Published data for RH-PG-979 in optical bonding configurations is limited; the processing window should be validated on target polarizer films because cyclic dimethyl siloxane migration can affect polarizer adhesion over 500 h at 65 °C/85% RH.

    When Connector Sealing Must Satisfy 85 °C/85% RH and Thermal Shock Requirements

    In automotive wire-to-board and high-voltage connector sealing, RH-PG-979 is applied as a soft-curing sealing gel at a mixing ratio of 1.00:1.00 by weight, with cured cone penetration controlled to 60–90 tenths of a millimeter per ISO 2137. Compliance standards include ISO 16750-4:2023 for environmental loads on electrical and electronic equipment, USCAR-2 for automotive electrical connector performance, IEC 60529 for IP67 ingress protection, and UL 94 V-0 flame classification. Downstream processing uses piston metering into connector cavities with a 10 mm static mixer, followed by cure at either 25 °C for 24 h or 100 °C for 10 min. Adhesion loss on polyamide 66 and polybutylene terephthalate substrates has been observed when surface energy falls below 34 mN/m; plasma or primer treatment is therefore applied to raise surface energy above 40 mN/m before dispensing. Terminal finished products include sealed automotive connectors, sensor housing seals, and wire harness grommets. The gel should not be combined with amine-based mold-release agents on nylon parts because premature crosslinking at the interface produces interfacial voids after thermal shock cycling.

    Prosthetic Liner Interface Pressure Redistribution and Tear Resistance

    RH-PG-979 is compounded for prosthetic liner and orthotic cushion segments at a Part A:Part B ratio of 1.00:1.00, with optional medical-grade silicone oil addition up to 5 phr to reduce Shore 000 hardness to 20–35 without changing cure kinetics beyond 5%. Compliance for this application includes ISO 10993-5:2009 for cytotoxicity, ISO 10993-10:2010 for sensitization, ISO 22523:2006 for limb prostheses and orthoses, and ISO 10328 for structural testing of lower limb prostheses. Downstream production is performed by injection molding into segmented aluminum molds with a mandrel at 100–120 °C, demolding after 8–10 min, and post-curing at 120 °C for 2 h to reduce extractables. Tear resistance is measured by ASTM D624-20, and elongation at break is controlled above 400% per ASTM D412-16. Terminal products include transtibial gel liners, orthotic heel cups, and metatarsal pads. Specific published data for RH-PG-979 in dynamic prosthetic liner loading is limited; long-term durability should be confirmed under cyclic shear and moisture uptake testing at 37 °C and 85% RH for the intended service interval.

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    Certification & Compliance
    More Introduction

    Silicone Gel RH-PG-979 is a two-component, platinum-catalyzed addition-cure silicone gel supplied as a translucent liquid pair in a 1:1 weight-ratio kit. The designation RH-PG-979 covers a controlled-viscosity formulation intended for encapsulation of power electronics, optoelectronic assemblies, and flexible circuits where a soft, permanently stress-absorbing dielectric layer is required. Uncured components are low-viscosity fluids that deaerate rapidly under vacuum; the cured material remains gel-like rather than crosslinking to a rigid solid. Lot-wise quality records are maintained under ISO 9001:2015, and the material is supplied in 20 kg pails and 5 kg kit packages with a closed-mouth storage recommendation of 5 °C to 30 °C. The product is reported by the supplier to be compliant with REACH and RoHS directive 2011/65/EU as amended by 2015/863; the certificate of compliance is issued on a per-lot basis.

    What Limits Cure Uniformity in Deep-Section Power Module Potting?

    In deep-section electronic modules exceeding 6 mm fill depth, the main limitations are not cure speed but entrapped air, substrate surface inhibition, and thermal equilibrium through the potting cross-section. Because RH-PG-979 is an addition-cure system, it does not release acetic acid, methanol, or oxime byproducts during polymerization; therefore, volumetric shrinkage remains below 0.1 % after a 24 h room-temperature cure when measured by calibrated displacement according to an internal method based on ISO 10563:2017. Off-ratio mixing outside 0.95:1.00 to 1.05:1.00 by weight can produce an under-catalyzed bulk with elevated dissipation factor at 1 kHz or a stiffened gel with reduced penetration. Production-scale vacuum chamber settings of 2 mbar to 10 mbar absolute pressure are recommended until visible foam collapse; typical degas time for a 500 g batch is 3 min to 5 min. A 30 min cure at 80 °C is used for production; for temperature-sensitive substrates, 24 h at 23 °C yields equivalent volume resistivity, but adhesion build on PPA and LCP may require the elevated cure. Substrate baking at 80 °C for 30 min to 60 min is advised when ambient relative humidity exceeds 60 % to avoid interfacial microvoids.

    Typical uncured and cured properties of Silicone Gel RH-PG-979
    PropertyValueTest method
    Mixed viscosity at 25 °C875 mPa·sASTM D2196-20
    Specific gravity, cured0.98ISO 1183-1:2019
    Refractive index, 25 °C1.405ISO 489:2022
    Cone penetration, cured 24 h/23 °C9.0 mmISO 2137:2017
    Dielectric strength20 kV/mmASTM D149-20
    Volume resistivity1.0 × 1015 Ω·cmASTM D257-14
    Dielectric constant at 1 kHz2.8ASTM D150-18
    Dissipation factor at 1 kHz0.001ASTM D150-18
    Thermal conductivity0.18 W/(m·K)ASTM D5470-17
    Service temperature, continuous-60 °C to +200 °CIEC 60216-1:2013

    In LED driver encapsulation and optical coupling, RH-PG-979 is typically applied after a 2 mbar deaeration cycle. At a 2 mm thickness, spectral transmittance exceeds 90 % in the 400 nm to 800 nm range when tested per ASTM D1003-21. The refractive index of 1.405 reduces forward scatter at the interface with many phenyl-silicone primary optics, although the user should measure total luminous transmittance on the final optic cavity before release. For thermal management, the gel provides a heat transfer path from surface-mounted components to an external heat spreader only when the bond line is thin; for modules requiring thermal conductivity above 0.5 W/(m·K), a filled grade should be selected instead. Published data for this specific configuration under high-flux UV-A exposure is limited; long-term yellowing therefore requires qualification with UV-stable topcoats or cover lenses.

    A processing checklist for 1:1 meter-mix dispensing

    Production lines using positive-displacement meter-mix equipment fitted with a static mixer of 24 elements have dispensed RH-PG-979 at 40 g/min to 200 g/min without visible streaking, provided the storage pails are conditioned to 23 °C before use. The following sequence is observed: precondition part A and part B for 12 h at 23 °C, purge the static mixer with 3 to 5 shot volumes, adjust ratio to 1.000 ± 0.005 by weight, degas mixed material at 5 mbar for 180 s, then dispense into modules with fill nozzles held below the liquid surface to reduce air entrapment. Pot life at 25 °C is 60 min; after that interval, mixed viscosity doubles and penetration of the final gel decreases by approximately 1 mm. In forced-air convection ovens, the center of a 10 mm thick polycarbonate housing reaches 80 °C after approximately 25 min; cure time should therefore be measured from thermal equilibrium inside the potting cavity, not from oven setpoint. Do not use pneumatic unheated single-component drums with nitrogen blanketing when ambient dew point is above 10 °C; condensation on cold metal surfaces can introduce microscopic voids that lower dielectric strength.

    Compared with condensation-cure silicone gels that release acetic acid or methanol, RH-PG-979 produces no volatile curing byproduct, which eliminates corrosion risk on copper leadframes and silver-plated connectors. The addition-cure chemistry also permits deep-section curing without reversion at the center, a failure mode observed in condensation-cure systems when volatile byproducts are trapped in thick joints. Table 2 summarizes class-level comparisons with other encapsulant technologies. These values are representative class attributes from industrial technical bulletins; direct product-to-product comparisons require lot-specific data from the competing material supplier.

    Comparative classes of encapsulants used in low-stress electronic protection
    AttributeRH-PG-979 addition-cure gelCondensation-cure silicone gelRigid epoxy encapsulant
    Cure byproductNoneAcetic acid or methanolNone
    Cured modulus≤ 0.1 MPa0.5–5 MPa3000 MPa
    Shrinkage after 24 h< 0.1 %0.5 %–1.5 %1 %–3 %
    Thermal conductivity0.18 W/(m·K)0.15–0.20 W/(m·K)0.4–1.0 W/(m·K)
    ReworkabilityMechanical removal possibleLimited solvent removalDifficult
    Maximum continuous service+200 °C+180 °C+150 °C

    When Reworkability and Low Stress Take Priority Over Shore Hardness

    When a field-replaceable unit must be reopened without damaging wire bonds, RH-PG-979 can be cut with a soft silicone spatula and lifted away. Because the cured gel remains below Shore 00 30, local mechanical removal does not transmit shear above 0.5 MPa to adjacent 25 µm gold-wire bonds. This low hardness also means the material is not suitable as an abrasion-resistant outer surface. If the design requires a self-leveling or structural exterior, a separate silicone elastomer overcoat is specified. For optical assemblies, mechanical removal may leave trace residue at the substrate interface; solvent-assisted cleaning with isopropanol and a lint-free wipe is standard practice, but final optical transmittance must be re-qualified after rework.

    On aluminum, stainless steel, FR-4, polycarbonate, and platinum-cured silicone substrates, primerless adhesion is typically achieved after cure at 80 °C for 30 min. On high-hardness anodized aluminum with sealed pores, a reactive vinyltrimethoxysilane primer is recommended; empirical lot-specific data for this configuration are limited, and qualification by lap shear or thermal cycle is therefore required before production release. Acidic surfaces, sulfur-cured rubber, or residues from tin-catalyzed silicone bonding must be isolated because they can inhibit the platinum catalyst and leave a tacky gel surface. Amine-based epoxy underfills, soldering flux activators, and airborne organotin compounds from nearby condensation-cure operations are known incompatibilities. Substrates with absorbed moisture should be baked at 100 °C for 2 h when relative humidity has exceeded 60 % for more than 24 h; otherwise interfacial adhesion loss may appear as delamination after thermal cycling. Chemical resistance to mineral transformer oil at 100 °C for 1000 h typically produces a penetration change below 8 % when tested per ISO 1817:2015. Flammability classification must be verified on the final assembly because a standalone 3 mm slab may not demonstrate the same rating as the potted module under UL 94.