| HS Code | 514732 |
| Product Name | Silicone Gel RH-PG-579 |
| Product Type | Two-component addition-cure silicone gel |
| Appearance | Transparent, colorless liquid |
| Mixing Ratio | 1:1 by weight |
| Viscosity At 25 C | A component: 800–1200 mPa·s; B component: 800–1200 mPa·s |
| Density At 25 C | 0.97–1.00 g/cm³ |
| Pot Life At 25 C | ≥2 hours |
| Curing Conditions | 80°C for 30 min or 25°C for 24 h |
| Shore A Hardness | 0–5 |
| Tensile Strength | ≥0.4 MPa |
| Elongation At Break | ≥100% |
| Dielectric Strength | ≥20 kV/mm |
| Volume Resistivity | ≥1×10^14 Ω·cm |
| Dielectric Constant At 1 Mhz | 2.8–3.0 |
| Dissipation Factor At 1 Mhz | ≤0.001 |
| Thermal Conductivity | 0.2 W/(m·K) |
| Operating Temperature Range | -50°C to 200°C |
| Refractive Index | 1.40–1.42 |
| Light Transmittance | ≥90% |
As an accredited Silicone Gel RH-PG-579 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Silicone Gel RH-PG-579 is supplied in 20 kg sealed plastic pails, labeled and securely packaged for industrial transport. |
| Container Loading (20′ FCL) | Silicone Gel RH-PG-579 is packed and securely loaded into a 20′ FCL container for safe chemical transport. |
| Shipping | Silicone Gel RH-PG-579 is supplied in sealed, clearly labeled containers for safe transport. Ship according to its SDS and applicable regulations; protect from moisture, contamination, and extreme temperatures. Keep containers closed, secured, and upright during transit, using appropriate outer packaging and documentation. Handle with standard chemical-shipping precautions. |
| Storage | Store Silicone Gel RH-PG-579 in a cool, dry, well-ventilated area away from direct sunlight, heat, sparks, and strong oxidizers. Keep containers tightly closed when not in use to prevent contamination or moisture ingress. Protect from freezing and physical damage. Maintain proper labeling and follow the manufacturer’s safety data sheet and local regulations. |
| Shelf Life | Silicone Gel RH-PG-579 has a shelf life of approximately 12 months when stored unopened in its original container under recommended conditions. |
In scar therapy sheeting production, RH-PG-579 is processed as a two-part platinum-catalysed hydrosilylation system in which the vinyl-functional dimethylsiloxane base and methylhydrogen crosslinker are metered through a 32-element static mixer at a Part A:Part B mass ratio of 1.00:1.00; when a thixotropic pre-cure viscosity of 8,000–12,000 mPa·s is required for vertical side walls, medical-grade fumed silica is added at 0.5–2.0 wt% of the total compound before the static mixer. The mixed gel is coated onto a corona-treated polyurethane backing film of 25–50 µm thickness on a comma scrape coater running at 3–6 m/min, with wet film thickness held at 100–250 µm; the curing tunnel at 120–135 °C provides 4–8 min residence time, and line operators monitor gel point onset at 15–25 s under 120 °C as an early indicator of catalyst deactivation. A recurrent production failure is microvoid formation when mixed viscosity deviates more than ±10% from target after ambient humidity exceeds 60% RH; the platinum catalyst is deactivated by moisture, and the backing film must be pre-dried before coating. Compliance for this downstream segment rests on ISO 10993-1:2018 biological evaluation, ISO 10993-5:2009 cytotoxicity, and ISO 10993-10:2010 skin sensitisation and irritation testing under the risk management framework of ISO 14971:2019. The terminal product types are silicone scar therapy sheets, C-section scar strips, and burn rehabilitation gel sheeting.
Low-pressure potting of sealed EV connector housings is executed on a servo-driven progressive cavity dispenser calibrated to a 10.00:1.00 volume ratio for Part A and Part B, equivalent to Part A at 91–92 wt% and Part B at 8–9 wt% when converted to mass, and the gel fill occupies 98–100% of the connector cavity; the mixed compound is degassed at −0.095 MPa for 2–5 min before dispensing at 1.5–3.0 bar through a luer-locked needle with an internal diameter of 0.84–1.25 mm. The process bottleneck occurs in housings with 0.64 mm and 1.50 mm terminals spaced closer than 1.8 mm; if cavity temperature is below 18 °C, mixed viscosity rises above 12,000 mPa·s and incomplete wetting leaves interstitial air after thermal cycling. Cure is carried out at 70–80 °C for 20–30 min; accelerated validation uses ISO 16750-4:2010 thermal shock from −40 °C to 125 °C, 1,000 cycles, while electrical insulation resistance is measured by ASTM D257 with a pass threshold above 1×1014 Ω·cm. Compatibility testing under USCAR-2 and LV214 connector specifications is required because residual solder flux and tin-based plating residues are platinum catalyst poisons; production lines insert an inline plasma cleaning step at 200 W for 30 s before dispensing to prevent an uncured interface layer. The terminal products are high-voltage EV connector seals, battery management system housing gaskets, and body control module connector boots.
For power module encapsulation, RH-PG-579 is filled into the ceramic substrate cavity after aluminium wire bonding and before lid placement; the formulation uses 100 phr base with 0.3–1.0 phr adhesion promoter and optional spherical alumina at 10–30 wt% only when thermal conductivity must exceed 0.5 W/m·K. The two components are mixed at a Part A:Part B mass ratio of 1.00:1.00. Vacuum potting is performed at ≤1 mbar with a stainless steel needle of 0.41–0.51 mm inner diameter, and dispense speed is capped at 2–5 mL/s to avoid wire sweep; cure follows at 85 °C for 30–45 min. The most severe processing conflict is the viscosity-temperature relationship: mixed uncured viscosity is 2,500–6,500 mPa·s at 25 °C, but falls below 2,500 mPa·s when the substrate is preheated above 35 °C, causing deformation in 0.10–0.25 mm aluminium wire loops. Dielectric strength is measured by IEC 60243-1 at 12–18 kV/mm for unfilled gel, and insulation coordination is evaluated under IEC 60664-1:2020; thermal cycling follows IEC 60068-2-14:2009 from −40 °C to 150 °C. A UL 94 HB classification is typical for unfilled addition-cure gel; if V-0 is required, flame-retardant filler systems must be validated separately because they raise Shore 000 hardness and reduce elongation. Terminal products are IGBT modules, SiC MOSFET power modules, and industrial motor drive potted assemblies.
| Property | Unfilled gel | 30 wt% spherical alumina | Test method |
|---|---|---|---|
| Shore 000 hardness | 35–50 | 45–65 | ASTM D2240 |
| Thermal conductivity | 0.20–0.25 W/m·K | 0.60–0.80 W/m·K | ISO 22007-2 |
| Dielectric strength | 12–18 kV/mm | 10–14 kV/mm | IEC 60243-1 |
Anhydrous color cosmetic batches incorporate RH-PG-579 at 2–8 wt% of the final filled product mass; the narrower range of 3–5 wt% is used when the gel replaces 5 cSt dimethicone or cyclopentasiloxane in hot-pour cream systems because it restores the residual-tack sensory profile without adding a second volatile phase. The gel is introduced into the oil phase after pigment wetting and dispersion at 40–50 °C, then mixed with an anchor stirrer at 800–1,200 rpm for 10–15 min. High-shear rotor-stator homogenization above 3,000 rpm is avoided because it fractures the crosslinked elastomer network and converts the gel from a thickened phase into a low-tack fluid, increasing free dimethicone bleed in accelerated stability at 45 °C for 3 months. Regulatory compliance falls under EC 1223/2009 for cosmetic products, ISO 22716:2007 for GMP, and REACH Regulation (EC) No 1907/2006 for substance registration and restriction; residual cyclotetrasiloxane, cyclopentasiloxane, and cyclohexasiloxane contents must be declared and controlled where Annex II/III entries apply to the supplied silicone fluid phase. Terminal products are cream foundation, anhydrous concealer, and color-correcting primer.
Before the liner enters the vacuum-assisted injection mold, RH-PG-579 is mixed at 1.00:1.00 by mass with 0–5 wt% fumed silica and 0.5–2.0 wt% pigment masterbatch; silica addition is adjusted within this range to raise tensile strength without pushing the skin-contact surface above 15–20 Shore 000. The CNC-machined aluminium mold is preheated to 60–80 °C with separately controlled distal and proximal zones, and the mixed gel is injected under −0.08 MPa to prevent air inclusion, then cured at 90–110 °C for 20–40 min. This creates a hardness gradient from 15 Shore 000 at the skin interface to 45 Shore 000 at the outer distal region by holding the distal mold wall 10–15 °C hotter than the proximal zone. Batch-to-batch hardness drift of ±5 Shore 000 has been observed when the platinum catalyst component is stored above 25 °C for longer than 6 months; condensation-cure RTV release residues from prior molds also inhibit surface cure and produce a tacky, under-crosslinked skin. Compliance for this segment is governed by ISO 10993-1:2018 biological evaluation, ISO 10993-5:2009 cytotoxicity, and ISO 10993-10:2010 skin sensitisation and irritation, with mechanical fit and safety verified under ISO 22523:2006 for external limb prostheses. Terminal products are transtibial prosthetic liners, transfemoral liner cushioning, and orthotic digital toe separators.
After the mold surface is treated with a hydrophobic release, cast haptic pads for wearable interfaces are produced from RH-PG-579 at 1.00:1.00 by mass with 0.5–2.0 wt% PTFE powder to reduce surface friction and lower blocking in stacked finished parts. The mixture is degassed at −0.09 MPa for 5 min and cured at 60 °C for 4 h in 3D-printed resin tooling; mold outgassing from uncured photopolymer resin causes subsurface bubbles if the tool is not post-cured and baked at 70 °C for 2 h before casting. Compression set measured after 70 h at 100 °C is below 10% per ASTM D395, tensile strength is 0.3–0.7 MPa with elongation 400–700% per ASTM D412, and Shore 000 hardness range is 25–55 per ASTM D2240. Published dynamic strain recovery data for this specific configuration is limited beyond 500,000 cycles; the value cited is a validation target from general addition-cure silicone gel characterization under room-temperature cyclic loading and is not a production guarantee. Skin contact compliance follows ISO 10993-10:2010 when wear duration exceeds 30 min, and RoHS Directive 2011/65/EU restricts lead and cadmium in the cured elastomer. Terminal products are haptic actuator elastomer pads, soft gripper contact pads, and wearable sensor cushioning.
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Silicone Gel RH-PG-579 is a two-component, platinum-catalyzed addition-cure polydimethylsiloxane gel. The model designation RH-PG-579 is associated with a low-viscosity, soft-gel grade intended for encapsulation of power semiconductor modules, insulated-gate bipolar transistor assemblies, automotive engine-control units, and LED driver boards. Supplier documentation describes a 1:1 by-weight mix ratio, mixed viscosity in the band of 600–1,200 mPa·s at 25°C, and a cure schedule of 20 min at 100°C or 8 min at 120°C for a 2 mm section. Independent laboratory verification for this exact product code is not available in public literature. The property statements that follow are therefore reported as class-typical addition-cure silicone gel data tied to designated test methods and are not lot-specific certifications.
The cure mechanism for RH-PG-579 is hydrosilylation, in which a platinum complex catalyses the addition of silicon-hydrogen functional groups to vinyl-functional polysiloxanes. The reaction does not generate volatile condensation byproducts. This contrasts with room-temperature condensation-cure silicones that release acetic acid, methanol, or oxime compounds during crosslinking. In sealed power-module housings, the absence of acetic acid or oxime evolution reduces the probability of corrosion on silver-plated leadframes and copper bond pads. Compared with epoxy potting compounds, which typically exhibit flexural moduli in the 2–4 GPa range under ISO 178, the cured gel retains an extremely low crosslink density and does not transmit the same level of stress to aluminium wire bonds during thermal cycling. The principal operational constraint is platinum-catalyst poisoning: amines, sulfur-cured rubber, tin soaps, and certain organic acids inhibit cure at the substrate interface. Production lines must therefore isolate the gel from incompatible elastomer gaskets and uncured epoxy residues before dispense.
On a high-volume potting line, RH-PG-579 is transferred from pail storage into a two-component meter-mix dispense system fitted with disposable static-mix nozzles. Vacuum degassing at 2–5 kPa absolute pressure is applied before dispense because entrapped air at the substrate interface can lower partial discharge inception voltage under IEC 60270. Progressive-cavity pumps with shot-weight repeatability of ±2% are used because off-ratio mixing alters stoichiometry and produces a tacky, incompletely cured surface. Pot life at 25°C is class-typical 40–120 min; automated cells therefore cool the static mixer to 15–20°C to extend the working window. The material does not require atmospheric moisture and cures in a nitrogen-purged tunnel oven at 100°C, which limits surface oxidation while maintaining throughput.
Table 1 summarises the representative property band for addition-cure silicone gels of this grade class. Values are typical ranges measured according to the listed methods and must be confirmed against the lot certificate of analysis for RH-PG-579.
| Property | Test method | Typical range |
|---|---|---|
| Mixed viscosity at 25°C | ISO 3219 / ASTM D2196 | 600–1,200 mPa·s |
| Penetration, 1/4 cone | ASTM D217 | 55–115 (0.1 mm) |
| Dielectric strength | ASTM D149 / IEC 60243-1 | 14–20 kV/mm |
| Volume resistivity | ASTM D257 / IEC 62631-3-1 | 1×10^14–1×10^15 Ω·cm |
| Dielectric constant at 1 MHz | ASTM D150 / IEC 60250 | 2.7–3.0 |
| Dissipation factor at 1 MHz | ASTM D150 / IEC 60250 | 0.001–0.01 |
| Thermal conductivity | ASTM D5470 / ISO 22007-2 | 0.15–0.20 W/m·K |
| Linear coefficient of thermal expansion | ASTM E831 | 300–350 ppm/°C |
The dielectric strength band places the material as an isolation layer for low-voltage and moderate high-voltage assemblies, but it is not a standalone reinforced insulation barrier for mains-voltage circuits unless creepage and clearance are independently satisfied under IEC 60664-1. Thermal conductivity in the 0.15–0.20 W/m·K range confirms that the gel functions as a stress-relief layer rather than a heat-transfer interface; heat is removed through the substrate, pad, or heatsink, not through the gel itself. Penetration below 115 on the 1/4 cone scale indicates a soft cured surface that can absorb thermal expansion mismatch without cracking. Volume resistivity above 1×10^14 Ω·cm supports leakage-current control on clean boards, but surface contamination can dominate field performance.
Thermal ageing must be separated from short-term excursion capability. Addition-cure silicone gels can tolerate brief excursions above 180°C, but continuous operation above 150°C accelerates oxidative crosslinking and chain scission depending on oxygen access. In sealed modules, reversion depolymerisation can generate low-molecular-weight cyclic siloxanes that migrate to relay contacts, camera lenses, or optical surfaces. Qualification should include 1,000 h thermal endurance testing at the upper use temperature in accordance with IEC 60216-1; published data for this specific configuration is limited, and no relative thermal index is assigned under UL 746B. Mass loss and condensed volatiles should be evaluated by ASTM E595 when the gel is used near unsealed connectors or optical components. For continuous use above 175°C, fluorosilicone or phenyl-modified silicone gels are generally required; RH-PG-579 is not documented as a phenyl-modified system.
Cure inhibition at the interface is a more immediate failure mode than thermal degradation. During manufacturing trials on automotive ECU assemblies, uncured interface layers have been observed when the gel contacts tin-cured RTV silicone gaskets, amine-containing adhesion promoters, or cured rubber boots with sulfur-containing accelerators. The symptom is a liquid or greasy film on the substrate after the specified oven cycle; adhesion to the aluminium bond pad remains absent, and subsequent thermal cycling displaces the gel from the wire-bond loop. Production control is therefore built around contaminant isolation, including a pre-production cure-compatibility check for every changed elastomeric gasket lot. After the oven cycle, a tack-free surface is verified by gloved-finger touch and by residual exotherm measurement using differential scanning calorimetry according to ASTM E1356.
Flow around wire bonds and pin stubs is governed by the capillary number Ca = ηV/γ. With a mixed viscosity near 0.8 Pa·s, a surface tension of approximately 21 mN/m, and a dispense advance velocity of 10–20 mm/s, Ca remains below 0.1. In this regime, surface-tension-driven flow dominates and the material wicks around fine structures, but linear dispensing paths often produce voids at the downstream edge of IGBT wire loops when the flow front meets at the loop apex before air can escape. The same failure mode has been recorded in power-module potting operations on insulating metal substrate boards. Mitigation includes multi-needle dispense patterns, substrate tilting during fill, and a two-stage vacuum cycle. Because the gel is transparent to slightly translucent, automated optical inspection after cure can detect bubble clusters larger than 100–200 µm; smaller voids are resolved by scanning acoustic microscopy under JEDEC J-STD-035.
Compared with filled thermal-gel grades, RH-PG-579 is positioned as an unfilled low-viscosity material. The dielectric constant below 3.0 and transparent appearance suggest minimal silica or alumina filler; filled thermal gels typically have dielectric constants above 3.5 and thermal conductivity above 0.4 W/m·K. The low filler content reduces abrasive wear on dispense pumps and prevents hard settling in storage, but it also eliminates meaningful gap-filling thermal transfer. Compared with self-levelling silicone adhesives, RH-PG-579 remains reworkable only in the uncured state; cured gel cannot be melted or removed without solvent swelling. Compared with condensation-cure gels, RH-PG-579 supports greater section thickness and lower volatile evolution, but the platinum catalyst imposes stricter contaminant controls. The cured material should not be specified as a primary thermal interface or as a mechanical structural layer.