| HS Code | 238846 |
| Product Name | Vinyl Silicone Resin S0826H |
| Chemical Type | Vinyl-group-containing silicone resin |
| Appearance | Colorless transparent liquid |
| Viscosity At 25c Mpa S | 3000-8000 |
| Vinyl Content Wt Percent | 1.0-1.5 |
| Refractive Index At 25c | 1.52-1.54 |
| Density At 25c G Cm3 | 1.05-1.10 |
| Solid Content Percent | ≥99 |
| Volatile Content Percent | ≤1.0 |
| Curing Condition | 150°C/1h + 180°C/2h |
| Shore A Hardness | ≥40 |
| Tensile Strength Mpa | ≥5.0 |
| Elongation At Break Percent | ≥30 |
| Light Transmittance Percent | ≥90 |
As an accredited Vinyl Silicone Resin S0826H factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Vinyl Silicone Resin S0826H is supplied in 200 kg steel drums with inner liners, sealed for safe transport and storage. |
| Container Loading (20′ FCL) | Vinyl Silicone Resin S0826H loaded in a 20-foot FCL container, securely packed, stowed, and sealed for safe ocean shipment. |
| Shipping | Shipping: Vinyl Silicone Resin S0826H is normally handled as a non-regulated/non-dangerous good if solvent-free. Use UN-approved, sealed containers; avoid heat, sunlight, and moisture; comply with local transport rules. If solvent-borne, ship per SDS as UN1993 Flammable Liquid, n.o.s., Class 3, PG II/III. |
| Storage | Store Vinyl Silicone Resin S0826H in a cool, dry, well-ventilated area away from direct sunlight, heat, ignition sources, and incompatible materials such as strong oxidizers and acids. Keep containers tightly closed, properly labeled, and protected from moisture and freezing. Follow the SDS, use appropriate PPE, and maintain spill containment and good housekeeping. |
| Shelf Life | Typical shelf life is 12 months from manufacture in unopened original packaging, stored cool, dry, and away from sunlight. |
In two-component addition-cure liquid silicone rubber, Vinyl Silicone Resin S0826H is pre-dispersed into the vinyl-terminated polydimethylsiloxane fraction at 10–30 phr because its vinyl-functional MQ architecture raises crosslink density without increasing base-gum plasticity to a level that would impede distribution through a static mixer. The A-side is compounded with a Karstedt catalyst at 2–8 ppm platinum based on total compound mass, while the B-side carries an inhibitor such as 1-ethynyl-1-cyclohexanol at 50–150 ppm to hold mixed pot life at 25 °C above 48 h. Metering is performed through a 1:1 dosing unit equipped with a static mixer containing 12–20 mixing elements. The blend is then injected into a mold held at 160–200 °C. Cure time for a 2 mm plaque is typically 20–45 s when measured by moving-die rheometer at 177 °C in accordance with ISO 6502. The upper resin loading is constrained by a viscosity cliff-edge: above 30 phr the mixed viscosity rise exceeds 400 Pa·s at 10 s⁻¹ according to ISO 3219, which can produce short shots at gate dimensions below 0.5 mm. On injection molding machines with screw L/D ratios of 18:1 and clamping force calculated at 20–50 kN per 100 mm² of projected area, backpressure is maintained below 1.5 MPa to prevent premature crosslinking inside the barrel. The cured compound is post-baked for 2–4 h at 200 °C to decompose residual catalyst-ligand byproducts. End-use parts include automotive connector seals, venting valves, medical syringe plungers, and infant-care components. Compliance for food-contact and medical grades requires extraction testing under FDA 21 CFR 177.2600, cytotoxicity testing under ISO 10993-5, and biological reactivity testing under USP <88> Class VI.
| Standard | Scope | Test condition |
|---|---|---|
| FDA 21 CFR 177.2600 | Rubber articles intended for repeated food-contact use | Extractives in water, heptane, 10% ethanol |
| USP <88> Class VI | Biological reactivity of elastomers | Acute systemic, intracutaneous, implantation |
| ISO 10993-5:2009 | In vitro cytotoxicity | MEM elution, 24 h |
| EU 10/2011 | Food-contact plastics | Overall migration 10 mg/dm² |
| REACH Annex XVII | Restricted substances | SVHC verification |
Within high-brightness LED package assembly, Vinyl Silicone Resin S0826H is pre-blended into a two-part addition-cure methyl or phenyl silicone matrix at 5–25 wt% to raise Shore hardness and reduce surface tack on the cured lens without lowering luminous transmittance below 95% at 450 nm for a 1 mm optical path, measured per ASTM D1003. Mixing is performed in a planetary centrifugal mixer at 800–1,500 rpm under 0.09 MPa vacuum for 3–5 min. The material is then dispensed onto lead-frame cavities or COB substrates by needle or jet dispensing equipment. A stepped cure profile of 100 °C for 60 min followed by 150 °C for 180 min is applied to prevent outgassing-related bubble inclusion in thick lenses. Key failure modes are platinum-catalyst inhibition by sulfur-containing die attach residues and capillary flow under the die that causes wire sweep. S0826H reduces the coefficient of linear thermal expansion in the cured encapsulant, which is measured by ISO 11359-2 thermomechanical analysis. The resin must be pre-dried at 80 °C for 2 h when storage relative humidity exceeds 60%, because silanol condensation in the MQ cage can raise viscosity and cause agglomerate formation. End products include SMD LED encapsulant domes, automotive LED module lenses, and optical couplers requiring UL 94 V-0 ignition resistance and IEC 62031 lamp safety compliance.
In solventless thermal-cure silicone release coatings, Vinyl Silicone Resin S0826H is introduced into the coating bath at 3–8 wt% of total solids to shift release force upward because its vinyl-MQ network increases surface crosslink density after cure. Coating is performed on a five-roll coater or reverse gravure unit onto biaxially oriented PET film or glassine. Wet coat weight is controlled to 0.8–1.6 g/m² using a doctor blade gap of 20–50 µm. The web passes through a hot-air oven at 130–160 °C with dwell time of 10–20 s, sufficient for platinum-catalyzed addition cure to reach a renewable silicone surface. Release force is measured at 180° peel angle and 300 mm/min pull speed using FINAT FTM 10 or ASTM D3330. Differential release liner construction places the S0826H-rich formulation on one side while the reverse side uses a lower resin loading or a silicone-free tie coat. Compliance for direct food-contact label stock requires migration testing under EU 1935/2004 and FDA 21 CFR 175.320, with extractable siloxane detection performed by GC-MS after heptane extraction. Operational limits are observed above 35 °C: bath pot life drops below 4 h when the resin loading exceeds 8 wt%, causing roll build-up and transfer defects on the coating roller. End products include release liners for acrylic adhesive labels, silicone-coated kraft paper for double-sided tape, and casting liners for polyurethane foam production.
On a two-roll mill set to a friction ratio of 1.2:1 and a roll temperature of 25–40 °C, Vinyl Silicone Resin S0826H is compounded into high-consistency silicone rubber at 10–20 phr prior to catalyst addition. The resin is milled for 8–12 min to avoid crumb dispersion defects. In peroxide-cure HCR, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane is added at 0.8–1.5 phr on a cool mill below 50 °C. In addition-cure HCR, a Karstedt catalyst at 5–15 ppm platinum and an inhibitor are added. The compound is press-cured at 170 °C for 10 min and then post-cured at 200 °C for 4 h in a forced-air oven. Post-cure is necessary to remove acidic volatiles from peroxide decomposition, which can corrode steel tooling and raise compression set. Mechanical properties are determined on 2 mm S2 dumbbells per DIN 53504; tear resistance is measured by ASTM D624 die C; compression set is evaluated after 22 h at 177 °C per ASTM D395. Increasing S0826H from 10 to 20 phr raises Shore A hardness and modulus, but published data for this specific resin configuration is limited above 20 phr. Screening is required because elongation at break and tear strength may decline as the network becomes over-crosslinked. End-use parts include oven gaskets, rubber rollers in laminating lines, extruded silicone profiles, and silicone sheet for die-cutting. Food-contact grades must comply with FDA 21 CFR 177.2600, BfR Recommendation XV, and LFGB.
Silicone pressure-sensitive adhesives for polyimide masking tapes are built around silanol-terminated or vinyl-functional PDMS and MQ resin at 50–80 parts per hundred liquid polymer. Vinyl Silicone Resin S0826H is dissolution-blended in toluene or xylene at 40–60 wt% solids, then catalyzed with benzoyl peroxide at 1–2 wt% of dry solids for condensation cure, or with a platinum catalyst at 20–60 ppm for addition cure. Coating onto 25 µm polyimide film is carried out by comma coater or slot-die at dry coat weights of 20–40 g/m². The web is dried at 80 °C for 3 min and cured at 150 °C for 5 min. Loop tack and 180° peel adhesion are tested per ASTM D6195 or ISO 29862. The migration rejection criterion is usually triggered by silicone transfer to copper or polyimide after 7 days at 70 °C under pressure; technical bulletins specify extractable content below 0.5 wt% after hexane extraction. S0826H lowers migration by increasing the resin network density, but addition levels above 80 phr can increase PSA peel build-up and convert the adhesive from clean-removal to residue-leaving. Incompatibility with amine-containing curing agents must be avoided due to platinum poisoning. End products include polyimide masking tape for PCB wave soldering, splicing tape for lithium-ion cell assembly, and silicone transfer film used in vacuum bagging.
Because Vinyl Silicone Resin S0826H carries reactive vinyl groups without high silanol residual content, it is dry-blended into alumina-filled addition-cure potting compounds at 2–8 wt% to prevent filler settling before cure. The formulation is mixed in a planetary vacuum mixer at 500–1,200 rpm under 0.095 MPa vacuum for 10 min. The catalyzed pot life is measured by a viscometer at 25 °C according to ISO 3219 and must remain below 3 times initial viscosity for at least 24 h. During potting of insulated-gate bipolar transistor modules, the material is dispensed under vacuum or low pressure into a case, then cured at 100 °C for 60 min. The cured compound is tested for thermal conductivity by ISO 22007-2 hot-wire method, dielectric strength by IEC 60243-1, and volume resistivity by IEC 62631-3-1. S0826H modifies the yield stress of the filled liquid so that alumina particles with D50 at 5–20 µm remain suspended, but above 8 wt% the mixed viscosity may exceed the processing limits of vacuum dispensing equipment. End products are potting compounds for photovoltaic junction boxes, power module encapsulation, and LED driver potting.
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Within addition-cure silicone chemistry, vinyl-functional MQ resins operate as co-reactive reinforcement agents because the vinyl substituents participate directly in platinum-catalyzed hydrosilylation rather than remaining as inert filler domains. Vinyl Silicone Resin S0826H is supplied as a transparent, colorless to pale-yellow liquid with a controlled vinyl equivalent weight, low residual silanol content, and reduced cyclic siloxane fraction. The grade is intended for solvent-based and solventless addition-cure formulations where high crosslink density, low volatile contribution, and optical clarity are required. Lot-release data are verified against ISO 3219:2021 for rotational viscosity, ISO 3251:2019 for non-volatile content, and ASTM E203-24 for moisture content. The values below are representative lot-release limits; the certificate of analysis for each production batch remains the controlling document.
| Property | Test method | Typical value or limit |
|---|---|---|
| Appearance under D65 illumination | Visual inspection | Clear, colorless to pale-yellow liquid |
| Non-volatile content | ISO 3251:2019 | 98.5–100.0 % |
| Rotational viscosity at 25 °C | ISO 3219:2021 | 12000–18000 mPa·s |
| Vinyl content | In-house iodometric titration | 0.45–0.60 mmol/g |
| Moisture | ASTM E203-24 | ≤0.10 % |
| Refractive index at 25 °C | ASTM D1218-21 | 1.4070–1.4120 |
| Density at 25 °C | ASTM D792-20 | 0.980–1.010 g/cm³ |
| Residual silanol | In-house FTIR | ≤0.5 wt% |
The primary structural distinction lies in vinyl distribution across the MQ framework. General-purpose vinyl MQ resins frequently contain a broad molecular-weight distribution with residual silanol concentration between 1.5 wt% and 3.0 wt%. S0826H is capped to reduce silanol below 0.5 wt% and to narrow the oligomeric envelope. The vinyl content is maintained at 0.45–0.60 mmol/g rather than the 0.10–0.25 mmol/g typical of low-functionalized resins. This higher vinyl density increases crosslink density in addition-cure networks, which raises Shore A hardness and reduces equilibrium solvent uptake in cured articles tested under ASTM D471-18a.
A second differentiator is the low volatile contribution. When the batch is subjected to non-volatile analysis at 150 °C for 3 h under ISO 3251:2019, residual volatile content remains ≤0.30 %, whereas lower-cost grades often release 1.0–2.0 % of cyclic siloxanes and oligomeric species. The reduced volatile load is significant for optically clear encapsulants because outgassing during thermal cure or subsequent LED junction operation produces haze and deposit on die surfaces.
| Parameter | S0826H | General-purpose vinyl MQ resin | Test method |
|---|---|---|---|
| Vinyl content | 0.45–0.60 mmol/g | 0.10–0.25 mmol/g | In-house iodometric titration |
| Residual silanol | ≤0.5 wt% | 1.5–3.0 wt% | In-house FTIR |
| Volatile content at 150 °C/3 h | ≤0.30 % | 1.0–2.0 % | ISO 3251:2019 |
| Cyclic siloxane content | ≤0.10 wt% | 0.5–1.5 wt% | In-house GC-FID |
Compared with methyl-only MQ resins, S0826H offers higher vinyl functionality and is therefore selected for addition-cure systems rather than condensation-cure systems relying on tin or titanium catalysts. Formulation behavior also differs. S0826H can be dispersed into vinyl-terminated polydimethylsiloxane with a high-shear disperser at 2500–3500 rpm for 15–20 min, producing a clear, bubble-stable base.
The addition-cure reaction of S0826H follows standard hydrosilylation kinetics with a platinum-cyclovinylmethylsiloxane complex. At a platinum loading of 5–10 ppm, gel time at 25 °C for a formulation containing a hydride crosslinker with a Si-H/Vi molar ratio of 1.2:1 to 1.6:1 is typically 45–90 min. Raising the cure temperature to 80 °C shortens the time to 15–30 min. In a bulk mass of 500 g, the crosslinking exotherm is usually 8–15 °C above oven setpoint under forced-air convection.
Cure-state reproducibility is sensitive to stoichiometry and temperature. When the Si-H/Vi ratio falls below 1.1:1, under-cure produces a tacky surface. Above 1.8:1, residual silicon hydride can generate hydrogen outgassing in humid environments. For solventless potting, the process window is held within ±5 °C of the selected curing temperature to avoid localized under-cure at the part wall and embrittlement in the core. Production lines achieve this with multi-zone forced-air ovens calibrated to ±2 °C uniformity and with parts of wall thickness below 10 mm.
Neat-resin viscosity at 25 °C is 12000–18000 mPa·s under ISO 3219:2021. Adding xylene or toluene at 30–50 wt% reduces viscosity to 300–700 mPa·s, depending on solvent and solids. In a 25 L planetary mixer with a helical stirrer at 20–40 rpm, a typical batch reaches a clear state after 15–20 min, followed by vacuum degassing at −0.090 MPa to below 0.050 MPa absolute for 10–15 min until air release is no longer visible.
On a production encapsulant line using a 20 L double-planetary mixer and a 2.5 L precision cartridge dispenser, the main batch-to-batch variance observed with S0826H is not resin viscosity but pigment or phosphor settling when the uncured base is stored at ambient for more than 48 h. The resin’s low water content reduces the risk of silanol condensation during storage, but containers must be blanketed with dry nitrogen after each use. Uncontrolled exposure to relative humidity above 60 % can restore moisture above 0.10 % and shift pot life by 10–20 min in solventless systems.
Optical encapsulants formulated with S0826H are typically compounded with vinyl-terminated phenyl silicones to adjust refractive index. The resin itself has a refractive index of 1.4070–1.4120 at 25 °C under ASTM D1218-21. Formulations requiring 1.50–1.54 refractive index must incorporate phenyl-functionalized co-resins because S0826H alone remains near 1.41. A 2 mm thick cured film containing 40 wt% S0826H and a hydride crosslinker can exhibit total luminous transmittance above 92 % and haze below 1.0 % when measured under ASTM D1003-21 with D65 illuminant. Published data for this specific configuration is limited; optical values are formulation-dependent and require confirmation on the end article.
Thermal aging data are also formulation-dependent. In a representative formulation cured for 2 h at 80 °C and then 4 h at 150 °C, Shore A hardness changes by less than 3 points after 500 h at 150 °C. Yellowness index under ASTM E313-20 increases from 0.8 to 2.5 in that interval when phenyl co-resin content is high. The low cyclic siloxane fraction of S0826H reduces surface deposit formation on package interior walls during accelerated thermal cycling.
For applications where platinum-catalyst poisoning is a risk, S0826H must not be combined with amine-functional silanes or tin-based condensation-cure catalysts. Residual vinyl groups can be consumed by side reactions or catalyst deactivation can prevent hydrosilylation. Silanol-containing fumed silica should be pre-treated or added after the resin is fully dispersed to avoid premature gelation at room temperature.
Regulatory documentation for S0826H lists compliance with REACH registration obligations and the restriction list of REACH Annex XVII as applied to the supplied mixture. The product is formulated to meet the hazardous substance limits of RoHS 2011/65/EU for lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. Food-contact use requires verification against the end article; the resin is not certifiable as a direct food additive under FDA 21 CFR 177.2600 unless the finished cured article is tested for extractables.
Solventless formulations containing S0826H are best processed below 35 °C before cure initiation. Above this temperature, the pot life of a standard formulation falls by roughly 50 % for each 10 °C increase, and viscosity drift becomes measurable within 30 min. The resin is incompatible with strong acids and bases, which catalyze siloxane bond redistribution and may broaden molecular weight. If pre-drying is required, a vacuum oven at 80 °C and −0.090 MPa for 2 h is sufficient for a 1 L aliquot, provided the oven atmosphere is inert.
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