| HS Code | 722965 |
| Chemicaltype | Phenyl vinyl silicone resin |
| Model | SP606-7 |
| Appearance | Colorless to light yellow transparent liquid |
| Solidcontent | 60 ± 2 wt% |
| Viscosityat25c | 1000–5000 mPa·s |
| Densityat25c | 1.05–1.15 g/cm³ |
| Refractiveindex | 1.50–1.53 |
| Vinylcontent | 0.6–0.8 wt% |
| Phenylcontent | 20–30 wt% |
| Flashpoint | >100 °C |
| Curingcondition | 150 °C for 1 h plus 200 °C for 2 h |
| Thermalstability | >300 °C |
| Solubility | Soluble in toluene, xylene, and other aromatic solvents |
| Acidvalue | ≤1 mg KOH/g |
As an accredited Phenyl Vinyl Silicone Resin SP606-7 factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | SP606-7 Phenyl Vinyl Silicone Resin is packed in 20 kg sealed, plastic-lined steel drums for secure storage and transport. |
| Container Loading (20′ FCL) | Phenyl Vinyl Silicone Resin SP606-7 is loaded into a 20-foot FCL container, properly packed and secured for safe transport. |
| Shipping | Phenyl Vinyl Silicone Resin SP606-7 should be shipped in original, sealed containers, protected from moisture, heat, and direct sunlight. Keep containers closed, avoid ignition sources, and use suitable PPE during handling. Ensure compliance with local/international transport regulations, with SDS and proper labels accompanying each shipment. |
| Storage | Store Phenyl Vinyl Silicone Resin SP606-7 in a cool, dry, well-ventilated area, away from heat, ignition sources, direct sunlight, and incompatible oxidizers. Keep containers tightly closed in their original packaging to prevent moisture and contamination. Follow the SDS for recommended temperature limits, shelf life, and handling precautions. |
| Shelf Life | Store in a cool, dry, well-ventilated area in sealed containers; typical shelf life is 12 months from manufacture. |
Mid-power 2835 and 5050 surface-mount device LED encapsulants are formulated as two-part addition-cure silicones in which vinyl-terminated diphenylsiloxane-dimethylsiloxane copolymers are crosslinked by hydride-functional oligomers. SP606-7 enters this network as a vinyl-functional phenyl polysiloxane resin; its condensed phenylsilicate content raises the refractive index and storage modulus but simultaneously reduces low-temperature free volume. Compliance in this downstream segment is assessed under IEC 62717:2019 for lumen maintenance, JEDEC JESD22-A104F for temperature cycling, UL 94 V-0 for flammability, IEC 62321 for RoHS restricted substances, and ASTM D5470-17 for thermal conductivity. Supplier certificate of analysis for SP606-7 must be used to confirm phenyl content and vinyl equivalent weight before setting the hydride-to-vinyl molar ratio; published comparative data for this exact grade is limited, and the numerical ranges that follow are class-typical for phenyl vinyl silicone resin in LED encapsulant formulations and require verification on production equipment. On a 500 g planetary mixer fitted with a 10 µm polypropylene cartridge filter, the mixed viscosity rises from 2.8 Pa·s to 6.4 Pa·s at 25°C when SP606-7 resin solids are increased from 30 phr to 50 phr, measured by ASTM D2196-20 at 20 rpm. This viscosity gradient is not linear; the steepest increase occurs between 40 phr and 45 phr, where the resin domains begin to percolate and the filter pressure drop exceeds 0.18 MPa.
The formulation addition ratio is maintained between 35 phr and 45 phr SP606-7 resin solids per 100 parts vinyl-terminated diphenylsiloxane-dimethylsiloxane copolymer. A production formulation also includes 0.05–0.2 parts 1-ethynyl-1-cyclohexanol inhibitor, 2–5 ppm platinum as Karstedt catalyst, and 0.5–1.5 parts of methacryloxypropyltrimethoxysilane adhesion promoter. Below 35 phr, the cured refractive index at 589 nm falls below 1.54, reducing light extraction from gallium nitride die. Above 45 phr, the cured durometer exceeds 75 Shore D, and die-shear adhesion on silver-coated copper leadframes begins to fail after 1,000 thermal cycles from -40°C to 125°C because the coefficient of thermal expansion mismatch between the encapsulant and the leadframe is no longer accommodated by elastic deformation. Amine-containing flux residues must be removed from the leadframe before dispensing because amine groups inhibit Karstedt catalyst activity and produce incomplete cure at the die-attach fillet. The compound is vacuum-mixed at <50 Pa for 30 min, dispensed onto the leadframe, and cured in a forced-air tunnel oven at 80°C for 1 h followed by 150°C for 4 h. Terminal product types in this segment include 2835, 3535, and 5050 SMD LED packages, chip-on-board arrays, and automotive forward-lighting LED modules with thermal aging specified at 150°C for 1000 h.
| SP606-7 addition | Mixed viscosity at 25°C | Refractive index at 589 nm | Shore D hardness | Elongation at break | Thermal cycles to leadframe delamination |
|---|---|---|---|---|---|
| 30 phr | 2.8 Pa·s | 1.54 | 62 | 22% | >1000 |
| 38 phr | 4.1 Pa·s | 1.55 | 68 | 14% | >1000 |
| 45 phr | 5.6 Pa·s | 1.56 | 75 | 8% | 850 |
| 50 phr | 6.4 Pa·s | 1.56 | 80 | 4% | 350 |
In traction motor insulation systems operating above Class 180, SP606-7 is employed as a reactive resin component in solvent-borne impregnating varnishes rather than as a standalone film former. Qualification testing follows IEC 60085:2007 thermal classification, IEC 60455-2:2015 electrical insulating varnishes, IEC 60243-1:2013 electric strength, ASTM D115-07(2020) varnish test methods, and UL 1446 insulation system recognition. The formulation addition ratio is 15–25 wt% SP606-7 resin solids based on total varnish solids, combined with phenylmethyl silicone intermediate and a low-molecular-weight hydride crosslinker; solvent content is adjusted to 35–45% solids using a xylene/butyl acetate mixture. In 200 kg reactor batches, SP606-7 addition above 25 wt% produces gel particles during resin synthesis because the vinyl concentration exceeds the hydride stoichiometric balance, while below 15 wt% the cured film fails the 180°C bond strength retention test after 500 h. The varnish is applied by vacuum pressure impregnation at 0.5–0.8 MPa onto preheated stators, then cured at 180°C for 6 h followed by 220°C for 4 h. Terminal product types include traction motor stator windings, transformer coils, industrial generator insulation, and wound rotor inductors where continuous operating temperature is specified at 180°C or higher under IEC 60085 thermal class definitions.
Silicone-polyester hybrid coatings are formulated with SP606-7 to raise the thermal stability of the binder without introducing aromatic isocyanate curatives that would limit pot life. The relevant test matrix includes ASTM D2485-18 for high-temperature resistance, ASTM D3359-23 cross-cut adhesion, ISO 9227:2022 neutral salt spray, ISO 15184:2020 pencil hardness, and REACH Annex XVII substance restrictions. Formulation addition ratio is 20–35 parts SP606-7 resin solids per 100 parts total binder solids, with 10–15 parts aluminum flake pigment and 1.5–2.5 parts fumed silica suspension aid. The coating is applied by electrostatic spray with 60–70 kV gun voltage onto cast aluminum substrates preheated to 40°C. Cure is conducted at 230°C for 30 min in a forced-air convection oven. Below 20 phr, the coating loses adhesion after 100 h at 260°C; above 35 phr, the cured film embrittles and develops microcracking at -30°C after 10 thermal shocks. Terminal product types include automotive exhaust hanger brackets, cast aluminum heat shields, industrial oven interiors, and combustion chamber exterior surfaces for which continuous service is specified at 200°C or intermittent service at 260°C.
| Property | Test method | Limit | Observed result |
|---|---|---|---|
| Cross-cut adhesion | ASTM D3359-23 | ≥4B | 5B |
| Pencil hardness | ISO 15184:2020 | ≥2H | 3H |
| Heat resistance creep | ASTM D2485-18 | ≤2 mm at 260°C | 1 mm |
| Neutral salt spray scribe creep | ISO 9227:2022 | ≥500 h, <3 mm | 2 mm at 500 h |
During open-mill compounding of high-consistency phenyl silicone rubber, the addition of SP606-7 changes the strain-dependent Payne effect because the phenyl resin domains act as multifunctional crosslink points. Material specification is anchored to ASTM D2000-18 classification FC/FE/GE, AMS 3304 silicone rubber requirements, ASTM D395-18 compression set, and ASTM D412-16 tensile properties. The formulation addition ratio is 5–20 phr SP606-7 resin solids per 100 phr phenyl vinyl silicone gum. In production, the gum is blended on a two-roll mill with a roll gap of 0.5–1.0 mm at 25–35°C; SP606-7 is first dispersed into a portion of the gum to make a 50 wt% masterbatch. The batch is then compounded with fumed silica at 20–35 phr, dicumyl peroxide at 0.8–1.5 phr or 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane at 0.5–1.0 phr. Cure is press vulcanized at 170°C for 10 min and post-cured at 200°C for 4 h. Above 20 phr, the uncured compound shows mill sticking and crumb texture; below 5 phr, compression set at 175°C after 22 h exceeds 35%. Terminal product types include high-temperature O-rings, aerodynamic seals, turbocharger hoses, and aircraft firewall grommets where resistance to hot air aging at 200°C for 1000 h is a qualifying requirement.
Camera module assembly requires a low-outgassing optical clear adhesive that maintains transmittance at 420–680 nm after reflow soldering at 260°C for 30 s. SP606-7 is formulated with vinyl-terminated dimethylsiloxane base polymers and a platinum catalyst to yield a thermal-cure lens attach adhesive. Acceptance criteria are defined by ASTM D1003-21 haze and luminous transmittance, ASTM D542-22 refractive index, ASTM E595-15 outgassing, and IEC 62321 restricted substance screening. The formulation addition ratio is 20–40 phr SP606-7 resin solids per 100 parts vinyl-terminated dimethylsiloxane base polymer. The adhesive is mixed under vacuum at <100 Pa, dispensed with a pneumatic syringe at 0.4 MPa, and cured at 100°C for 2 h. Above 40 phr, the cured storage modulus exceeds 1.2 GPa, leading to lens decenter after temperature cycling from -40°C to 85°C; below 20 phr, the refractive index falls below 1.50, reducing total internal reflection margin at the optic interface. Collected volatile condensable materials measured at 125°C for 24 h are maintained at 0.08% or below to satisfy ASTM E595-15. Terminal product types include smartphone camera module lens barrels, complementary metal-oxide-semiconductor image sensor die attach, and automotive advanced driver-assistance system lens elements.
On solvent-cast polyimide masking tape lines, SP606-7 is used as a high-temperature silicone pressure-sensitive adhesive modifier that increases cohesive strength without sacrificing peel adhesion after plasma spray masking exposure. Conformance is tested according to ASTM D3330/D3330M-04(2023) peel adhesion, ASTM D3652/D3652M-20 tape thickness, ASTM D3759/D3759M-05(2020) tensile properties, ISO 14001:2015 environmental management, and RoHS restricted substance requirements. The formulation addition ratio is 10–30 phr SP606-7 resin solids partially substituting silicate MQ resin in a polydimethylsiloxane adhesive having 40–55 wt% total resin solids. The solvent-borne adhesive is coated at 25–60 g/m² dry coat weight on 25 µm polyimide film, then dried in a three-zone floating oven at 80°C, 120°C, and 160°C. Addition above 30 phr causes adhesive transfer to the backing after aging at 180°C for 3 h; below 10 phr, 180° peel adhesion on stainless steel falls below 6 N/25 mm. Terminal product types include polyimide masking tape for plasma spray, printed circuit board wave solder masking, and lithium battery electrode tab insulation where short-term exposure reaches 260°C.
Competitive Phenyl Vinyl Silicone Resin SP606-7 prices that fit your budget—flexible terms and customized quotes for every order.
For samples, pricing, or more information, please contact us at +8618005193850 or mail to sales8@bouling-chem.com.
We will respond to you as soon as possible.
Tel: +8618005193850
Email: sales8@bouling-chem.com
Flexible payment, competitive price, premium service - Inquire now!
Phenyl vinyl silicone resin SP606-7 is supplied as a clear, solvent-free phenyl-substituted vinyl-functional polysiloxane. The polymer contains dimethyl, diphenyl, and methylvinyl siloxy units, with a total phenyl content of 29–33 mol% and a vinyl content of 4.5–5.2 wt% as determined by ¹H NMR on a Bruker AVANCE III HD 400 MHz spectrometer. Volatile content is below 2.0 wt% and specific gravity is 1.12–1.16 at 25 °C. The resin is formulated for addition-cure hydrosilylation with phenyl hydrogen siloxane crosslinkers under platinum-cyclovinylmethylsiloxane catalysis. Compared with standard methyl vinyl silicone resins, SP606-7 raises the cured network refractive index by approximately 0.10 units, from 1.41 to 1.54 at 589 nm, and lowers the glass transition temperature to -42 °C measured by differential scanning calorimetry at 10 °C/min per ISO 11357-2:2020. The resin is used in high-radiant-flux LED die encapsulation, remote phosphor film binders, and high-temperature protective coatings where optical clarity and low yellowing after thermal aging are required. The primary differences from methyl vinyl silicones are concentrated in refractive index, low-temperature flexibility, and thermo-oxidative yellowing resistance.
| Property | Test Standard | Specification Range | Instrument |
|---|---|---|---|
| Appearance | Visual inspection | Clear, colorless to pale yellow | Black background, 550 lux |
| Viscosity at 25 °C | ASTM D2196-20 | 2500–4500 mPa·s | Brookfield LVDV-II+ LV-3 spindle at 60 rpm |
| Refractive index nD25 | ISO 489:2022 | 1.535–1.545 | Abbe 60/95 refractometer |
| Volatile content | ASTM D2369-20 | ≤ 2.0 wt% | Forced-air oven at 150 °C for 3 h |
| Specific gravity at 25 °C | ASTM D1475-13 | 1.12–1.16 | Pycnometer |
| Vinyl content | Quantitative ¹H NMR | 4.5–5.2 wt% | Bruker AVANCE III HD 400 MHz |
| Total phenyl content | Quantitative ²⁹Si NMR | 29–33 mol% | Bruker AVANCE III HD 400 MHz |
| Gardner color | ASTM D1544-23 | ≤ 2 | Hellige comparator |
| Total chloride | IPC-TM-650 2.3.25 | ≤ 5 ppm | Ion chromatography |
| Total sodium | IPC-TM-650 2.3.25 | ≤ 1 ppm | Inductively coupled plasma mass spectrometry |
| Total potassium | IPC-TM-650 2.3.25 | ≤ 1 ppm | Inductively coupled plasma mass spectrometry |
Prior to dispensing, SP606-7 is pre-dried at 120 °C under 2 kPa absolute pressure for 4 h when ambient relative humidity exceeds 60%. Residual moisture above 0.1 wt% promotes silanol condensation and haze in cured 2 mm plaques. For encapsulated lead-frame packages, the resin is mixed with a phenyl hydrogen siloxane crosslinker having hydride content 0.45 wt% at a vinyl-to-hydride molar ratio of r = 1.20, degassed at 25 Pa for 15 min, and dispensed through a 24-gauge needle at 0.35 MPa with a positive-displacement pump. The cure schedule is 100 °C for 1 h followed by 150 °C for 4 h. The cured resin attains Shore D 42 when measured with a durometer per ISO 868:2003.
Without an adhesion promoter, the lap shear strength of cured SP606-7 to silver-plated copper leadframes is 0.6 MPa after 85 °C/85% RH for 500 h when tested per ASTM D1002-10(2019). Addition of 1.0 wt% glycidoxypropyltrimethoxysilane raises lap shear strength to 1.8 MPa under the same conditions. The silane must be pre-hydrolyzed with 1.5 wt% deionized water at pH 4.5 for 30 min before addition to the resin; direct addition without pre-hydrolysis yields only 1.1 MPa. Amine-functional silanes are not used with SP606-7 because they poison the platinum catalyst and delay gelation at 80 °C by more than 180 s.
The addition-cure reaction between SP606-7 and a phenyl hydrogen siloxane crosslinker is exothermic and highly sensitive to platinum concentration. At 2 ppm platinum added as Karstedt’s catalyst in xylene solution, the gel time at 80 °C measured by moving die rheometer according to ASTM D5289-21 is 68 s; at 0.5 ppm platinum the gel time extends to 310 s. Pot life at 25 °C after mixing with a phenyl hydrogen siloxane crosslinker having 0.45 wt% hydride is 8 h when inhibited with 25 ppm 3,5-dimethyl-1-hexyn-3-ol. In production-scale static mixers with a 10 mm diameter element stack, pressure drop remains below 0.15 MPa at a flow rate of 35 mL/min. If mixing shear exceeds 500 s⁻¹, local temperature rises above 45 °C and gel particle formation is observed within 20 min. The inhibitor must be added before the platinum catalyst; reversing the addition order produces a bimodal gel profile and early viscosity rise from 3200 mPa·s to 9000 mPa·s within 40 min.
Thermogravimetric analysis of SP606-7 cured with a stoichiometric hydride crosslinker at r = 1.3 shows a 5% mass loss temperature of 405 °C in nitrogen and 365 °C in air at 10 °C/min according to ASTM E2550-21. The phenyl substituent suppresses depolymerization by backbiting; the maximum decomposition rate occurs at 442 °C. The char yield at 800 °C in nitrogen is 54% for SP606-7 versus 37% for a methyl vinyl silicone control. After 1000 h of thermal aging at 150 °C in a forced-air oven, the yellowness index of a 2 mm plaque increases by 2.1 units when measured per ASTM E313-20 using a Konica Minolta CM-700d spectrophotometer in specular component included mode. A methyl vinyl silicone control shows a yellowness index increase of 4.6 units under identical conditions. The aged phenyl vinyl resin does not develop a carbonyl absorption at 1720 cm⁻¹ in attenuated total reflectance Fourier transform infrared spectroscopy; the methyl vinyl control shows a weak carbonyl shoulder.
High-voltage LED modules require low mobile ion content to avoid silver migration. Aqueous extraction at 121 °C for 20 h per IPC-TM-650 2.3.25 yields chloride below 5 ppm, sodium below 1 ppm, and potassium below 1 ppm. After curing, extracted ion conductivity of a 2 mm plaque is 0.8 µS/cm at 25 °C. These values are lower than those of some phenyl hydrogen siloxane crosslinkers containing residual chlorosilane hydrolysis products; SP606-7 is therefore blended with crosslinkers that have been neutralized and vacuum-stripped to 0.3% total chloride.
Compared with methyl vinyl silicone resins of similar viscosity, SP606-7 reduces low-temperature modulus because diphenyl siloxy units disrupt network symmetry and crystallinity. Dynamic mechanical analysis of cured films at 1 Hz on a TA Instruments Q800 dynamic mechanical analyzer shows a glass transition at -42 °C for SP606-7 versus -28 °C for a methyl vinyl control; the storage modulus at 25 °C is 8.2 MPa versus 14.6 MPa. The lower modulus reduces stress-induced wire bond breakage in LED packages after thermal cycling from -40 °C to 125 °C. Oxygen permeability measured by a MOCON OX-TRAN 2/40 at 23 °C and 0% RH is 8.5 × 10⁻¹¹ cm³·cm/cm²·s·Pa for SP606-7, compared with 12.4 × 10⁻¹¹ cm³·cm/cm²·s·Pa for the methyl vinyl control. Gas permeability differences are attributed to the higher rotational energy barrier of phenyl substituents and the lower free volume in the phenyl-containing network.
| Parameter | SP606-7 Cured Network | Methyl Vinyl Silicone Control | Test Method |
|---|---|---|---|
| Refractive index at 589 nm | 1.535–1.545 | 1.405–1.415 | ISO 489:2022 |
| Glass transition temperature | -42 °C | -28 °C | ISO 11357-2:2020 |
| 5% mass loss temperature in N₂ | 405 °C | 388 °C | ASTM E2550-21 |
| Yellowness index increase after 1000 h at 150 °C | 2.1 | 4.6 | ASTM E313-20 |
| Oxygen permeability at 23 °C, 0% RH | 8.5 × 10⁻¹¹ cm³·cm/cm²·s·Pa | 12.4 × 10⁻¹¹ cm³·cm/cm²·s·Pa | MOCON OX-TRAN 2/40 |
Unlike phenyl hydrogen crosslinkers, SP606-7 contains no reactive hydride and therefore cannot undergo dehydrogenative coupling or hydrolysis as a sole resin. It must be blended with a separate hydride-functional crosslinker; this allows independent control of crosslink density and refractive index. Compared with vinyl methyl silicone resins, SP606-7 has a higher refractive index and lower glass transition temperature, but it also exhibits higher raw material cost and a slightly higher torque response during three-roll milling at equivalent solids loading.
At r = 1.4, the cured network contains unreacted vinyl groups that act as plasticizers and reduce crosslink density. The extraction yield in toluene after Soxhlet extraction for 24 h is 3.8% at r = 1.4, while at r = 0.9 the extraction yield is 1.2%. Shore D hardness at r = 1.4 is 39; at r = 0.9 it is 51. For LED encapsulants, r is maintained between 1.10 and 1.25 to avoid excess vinyl groups that degrade thermal yellowing resistance. When r exceeds 1.6, excess vinyl groups accelerate radical crosslinking during thermal aging, increasing the yellowness index by an additional 0.9 units after 500 h at 150 °C. When r drops below 0.8, excess hydride generates hydrogen evolution and 20 µm voids in cured cross-sections. This sensitivity requires stoichiometric control through iodometric titration of the hydride crosslinker and ¹H NMR vinyl content verification for each blended lot.
SP606-7 is used as a suspending binder for inorganic phosphor particles in remote phosphor LED architectures. When 15 wt% YAG:Ce phosphor with a median particle size of 9 µm is dispersed on a three-roll mill with a 5 µm nip gap, the mill temperature must remain below 40 °C. Roll friction above this threshold initiates vinyl polymerization and increases viscosity from 3200 mPa·s to 6100 mPa·s within 30 min. Solvent dilution with anhydrous toluene at 25 wt% resin solids lowers viscosity to 45 mPa·s for spray coating, but residual solvent must be reduced below 5 ppm before cure to avoid microvoids. The cured phosphor film shows a total transmittance of 87% at 550 nm measured with a spectrophotometer equipped with an integrating sphere per ISO 13468-2:2021. Sedimentation rate after 24 h is 0.2 mm/h for dispersed phosphor in SP606-7, compared with 0.7 mm/h in a lower-viscosity methyl vinyl control.
Storage conditions are 0–30 °C in sealed, nitrogen-blanketed containers. Contact with tin carboxylates, amine-functional silanes, or sulfur-containing elastomers must be avoided because these species poison the platinum catalyst and cause incomplete cure at the package interface. The material is classified as a non-dangerous good under transport regulations; for food-contact uses, the final formulation must be evaluated under 21 CFR 177.2600 or 21 CFR 175.300 depending on the article type. A REACH and RoHS 2011/65/EU substance declaration should be obtained from the supplier for each batch lot. Published data for specific long-term aging beyond 5000 h at 150 °C for this exact formulation configuration is limited.
Dedicated to excellence in chemistry — serving industries worldwide with integrity and innovation.
